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參數(shù)資料
| 型號(hào)： | TS68C000DESC02ZCA |
| 廠商： | E2V TECHNOLOGIES PLC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 10 MHz, MICROPROCESSOR, CQFP68 |
| 封裝： | GOLD PLATED, CERAMIC, QFP-68 |
| 文件頁數(shù)： | 5/52頁 |
| 文件大?。?/td> | 667K |
| 代理商： | TS68C000DESC02ZCA |
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13
2170A–HIREL–09/05
TS68C000
2.
CMOS Applications
The TS68C000 completely satisfies the input/output drive requirements of CMOS logic
devices.
The HCMOS TS68C000 provides an order of magnitude power dissipation reduction when
compared to the HMOS TS68000. However, the TS68C000 does not offer a "power down" or
"halt" mode. The minimum operating frequency of the TS68C000 is 4 MHz.
2.4.5
Thermal Characteristics
2.4.5.1
Power Considerations
The average chip-junction temperature, T
J, in °C can be obtained from:
T
J = TA + (PD . θJA)(1)
T
A = Ambient Temperature, °C
θ
JA = Package Thermal Resistance, Junction-to-Ambient, °C/W
P
D = PINT + PI/O
P
INT = ICC x VCC, Watts – Chip Internal Power
P
I/O = Power Dissipation on Input and Output Pins – User Determined
For most applications P
I/O < PINT and can be neglected.
An Approximate relationship between P
D and TJ (if PI/O is neglected) is:
P
D = K: (TJ + 273)
(2)
Solving equations (1) and (2) for K gives:
K = P
D. (TA + 273) + θJA PD
2
(3)
where K is constant pertaining to the particular part K can be determined from the equation (3)
by measuring PD (at equilibrium) for a known T
A. Using this value of K, the values of PD and TJ
can be obtained by solving equations (1) and (2) iteratively for any value of T
A.
The total thermal resistance of a package (
θ
JA) can be separated into two components, θJC and
θ
CA, representing the barrier to heat flow from the semiconductor junction to the package (case),
surface (
θ
JC) and from the case to the outside ambient (θCA).
Table 2-3.
Thermal Characteristics
Package
Symbol
Parameter
Value
Unit
DIL 64
θ
JA
Thermal resistance junction to ambient
25
°C/W
θ
JC
Thermal resistance junction to case
6
°C/W
PGA 68
θ
JA
Thermal resistance junction to ambient
30
°C/W
θ
JC
Thermal resistance junction to case
6
°C/W
LCCC 68
θ
JA
Thermal resistance junction to ambient
40
°C/W
θ
JC
Thermal resistance junction to case
8
°C/W
CQFP 68
θ
JA
Thermal resistance junction to ambient
40
°C/W
θ
JC
Thermal resistance junction to case
10
°C/W
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| TS68C000DESC03UAA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:LOW POWER HCMOS 16/32 BIT MICROPROCESSOR |
| TS68C000DESC03UCA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:LOW POWER HCMOS 16/32 BIT MICROPROCESSOR |
| TS68C000DESC03XAA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:LOW POWER HCMOS 16/32 BIT MICROPROCESSOR |
| TS68C000DESC03XCA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:LOW POWER HCMOS 16/32 BIT MICROPROCESSOR |
| TS68C000DESC03YAA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:LOW POWER HCMOS 16/32 BIT MICROPROCESSOR |
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