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參數(shù)資料
| 型號(hào)： | TMS32C6411AZLZ |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 數(shù)字信號(hào)處理 |
| 英文描述： | FIXED POINT DIGITAL SIGNAL PROCESSOR |
| 中文描述： | 定點(diǎn)數(shù)字信號(hào)處理器 |
| 文件頁(yè)數(shù)： | 8/119頁(yè) |
| 文件大?。?/td> | 1742K |
| 代理商： | TMS32C6411AZLZ |
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SPRS196H MARCH 2002 REVISED JULY 2004
8
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
device characteristics
Table 1 provides an overview of the C6411 DSP. The table shows significant features of the C6411 device,
including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type with pin count.
Table 1. Characteristics of the C6411 Processor
HARDWARE FEATURES
INTERNAL CLOCK
SOURCE
C6411
Peripherals
EMIF (32-bit bus width)
ECLKIN
1
Not all peripherals pins are
(For more details, see the
Device Configuration
section.)
EDMA (64 independent channels)
CPU/2 Clock Frequency
1
HPI (32- or 16-bit user selectable)
CPU/4 Clock Frequency
1 (HPI16 or HPI32)
available at the same time.
PCI (32-bit)
PCLK
1
McBSPs (McBSP0 and McBSP1)
CPU/4 Clock Frequency
2
Peripheral performance is
dependent on chip-level
configuration.
32-Bit Timers
CPU/8 Clock Frequency
3
General-Purpose Input/Outputs
(GPIOs)
CPU/8 Clock Frequency
16
Size (Bytes)
288K
On-Chip Memory
Organization
16K-Byte (16KB) L1 Program (L1P)
Cache
16KB L1 Data (L1D) Cache
256KB Unified Mapped RAM/Cache (L2)
CPU ID + CPU Rev ID
Control Status Register (CSR.[31:16])
0x0C01
Device_ID
Silicon Revision Identification Register
(DEVICE_REV [19:16])
Address: 0x01B0 0200
DEVICE_REV[19:16]
0010 or 0000
0011
Silicon Revision
1.1
2.0
Frequency
MHz
300
Cycle Time
ns
3.33 ns
Voltage
Core (V)
1.2 V
I/O (V)
3.3 V
PLL Options
CLKIN frequency multiplier
Bypass (x1), x6
BGA Package
23 x 23 mm
μ
m
Product Preview (PP)
Advance Information (AI)
Production Data (PD)
(For more details on the C64x
DSP part numbering, see
Figure 5)
532-Pin BGA (GLZ and ZLZ)
0.13
μ
m
Process Technology
Product Status
PD (1.1, 2.0)
Device Part Numbers
TMS320C6411GLZ
TMS320C6411AGLZ
PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice.
ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and
other specifications are subject to change without notice.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
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