參數(shù)資料
型號(hào): TMC57253HSOP
廠商: Texas Instruments, Inc.
英文描述: DRIVER
中文描述: 驅(qū)動(dòng)
文件頁(yè)數(shù): 9/11頁(yè)
文件大?。?/td> 134K
代理商: TMC57253HSOP
TMC57253
DRIVER
SOCS040A – MARCH 1994 – REVISED NOVEMBER 1994
9
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
MECHANICAL DATA
HSOP-B plastic small-outline package
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound.
The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will
remain stable when operated in high-humidity conditions. Leads require no additional cleaning or processing when
used in soldered assembly.
Seating Plane
0,15
M
0,13
1,27
24
13
1
12
0,50
0,30
0,20
0,30
15,20
19,50
18,90
15,40
2,65 MAX
0,10 MIN
10,80
10,00
7,40
7,60
1,20
0,40
6,65
6,35
0
°
– 10
°
7/94
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
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