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參數(shù)資料
| 型號： | TMC57253HSOP |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | DRIVER |
| 中文描述： | 驅(qū)動 |
| 文件頁數(shù)： | 4/11頁 |
| 文件大小： | 134K |
| 代理商： | TMC57253HSOP |
TMC57253
DRIVER
SOCS040A – MARCH 1994 – REVISED NOVEMBER 1994
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
CC
(see Note 1)
Continuous total power dissipation at (or below) T
A
= 25
°
C:
Unmounted device (see Figure 1)
Mounted device (see Figure 1)
Operating free-air temperature range, T
A
Storage temperature range, T
STG
Lead temperature: 1,6 mm (1/16 inch) from case for 10 seconds
1,6 mm (1/16 inch) from case for 3 seconds
0 V to 20 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1990 mW
2754 mW
–20
°
C to 45
°
C
– 55
°
C to 125
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
260
°
C
350
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltages are with respect to GND.
0
10
20
30
40
50
60
5
15
25
35
45
55
65
3000
2800
2600
2400
2200
2000
1800
1600
1400
1200
1000
TA– Free-Air Temperature –
°
C
P
70 75
Unmounted Device
Mounted Device
(see Note A)
POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
NOTE A: The mounted-device derating curve of Figure 1 is obtained under the following conditions:
The board is 50 mm by 50 mm by 1.6 mm thick.
The board material is glass epoxy.
The copper thickness of all the etch runs is 35 microns.
Etch-run dimensions – All twenty etch runs are 0.4 mm by 22 mm.
Each chip is soldered to the board.
An aluminum cooling fin 10 mm by 10 mm by 1 mm thick is coupled to the chip with thermal paste.
Figure 1
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