參數(shù)資料
型號： TLE214X_07
廠商： Texas Instruments, Inc.
英文描述： EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS
中文描述： 神劍低噪聲，高精密高速運(yùn)算放大器
文件頁數(shù)： 60/72頁
文件大小： 1324K
代理商： TLE214X_07
Orderable Device
Status
(1)
Package
Type
PDIP
Package
Drawing
N
Pins Package
Qty
25
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TLE2144CN
ACTIVE
14
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
25
Pb-Free
(RoHS)
25
Pb-Free
(RoHS)
40
1
1
CU NIPDAU
N / A for Pkg Type
TLE2144CNE4
ACTIVE
PDIP
N
14
25
CU NIPDAU
N / A for Pkg Type
TLE2144IDW
ACTIVE
SOIC
DW
16
40
CU NIPDAU
Level-1-260C-UNLIM
TLE2144IDWG4
ACTIVE
SOIC
DW
16
40
CU NIPDAU
Level-1-260C-UNLIM
TLE2144IDWR
ACTIVE
SOIC
DW
16
CU NIPDAU
Level-1-260C-UNLIM
TLE2144IDWRG4
ACTIVE
SOIC
DW
16
CU NIPDAU
Level-1-260C-UNLIM
TLE2144IN
ACTIVE
PDIP
N
14
CU NIPDAU
N / A for Pkg Type
TLE2144INE4
ACTIVE
PDIP
N
14
CU NIPDAU
N / A for Pkg Type
TLE2144MDW
TLE2144MFKB
TLE2144MJB
TLE2144MN
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
SOIC
LCCC
CDIP
PDIP
DW
FK
J
N
16
20
14
14
TBD
TBD
TBD
TBD
CU NIPDAU
POST-PLATE
A42 SNPB
Call TI
Level-1-220C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
3-Jul-2007
Addendum-Page 4
相關(guān)PDF資料
PDF描述
TLE214XA EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS
TLE2161MJG EXCALIBUR JFET-INPUT HIGH-OUTPUT-DRIVE mPOWER OPERATIONAL AMPLIFIERS
TLE2161MD EXCALIBUR JFET-INPUT HIGH-OUTPUT-DRIVE mPOWER OPERATIONAL AMPLIFIERS
TLE2161MFK EXCALIBUR JFET-INPUT HIGH-OUTPUT-DRIVE mPOWER OPERATIONAL AMPLIFIERS
TLE2161AMD EXCALIBUR JFET-INPUT HIGH-OUTPUT-DRIVE mPOWER OPERATIONAL AMPLIFIERS
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TLE2161ACD 功能描述:運(yùn)算放大器 - 運(yùn)放 Low Power JFET RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLE2161ACDG4 功能描述:運(yùn)算放大器 - 運(yùn)放 Excalibur JFET-Input Hi-Out-Drive uPower RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLE2161ACP 制造商:Rochester Electronics LLC 功能描述:- Bulk
TLE2161AID 功能描述:運(yùn)算放大器 - 運(yùn)放 Low Power JFET RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
TLE2161AIDG4 功能描述:運(yùn)算放大器 - 運(yùn)放 Low Power JFET RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比（最小值）:63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流（最大值）:10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
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