參數(shù)資料
型號: TLE2061AMU
廠商: Texas Instruments, Inc.
英文描述: Ring Tongue Solderless Terminal; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No
中文描述: 神劍JFET輸入高輸出驅(qū)動uPOWER運算放大器
文件頁數(shù): 29/75頁
文件大小: 1509K
代理商: TLE2061AMU
μ
SLOS193B FEBRUARY 1997 REVISED MAY 2004
29
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLE2062M electrical characteristics at specified free-air temperature, V
CC
±
=
±
15 V (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
TA
TLE2062M
TLE2062AM
TLE2062BM
UNIT
MIN
TYP
0.9
MAX
TLE2062M
25
°
C
Full range
25
°
C
Full range
25
°
C
Full range
4
6
VIO
Input offset voltage
TLE2062AM
0.8
2
mV
4
TLE2062BM
0.5
1
VIC = 0,
RS = 50
3
α
VIO
Temperature coefficient of input offset voltage
Full range
25
°
C
25
°
C
Full range
25
°
C
Full range
6
μ
V/
°
C
μ
V/mo
pA
Input offset voltage long-term drift (see Note 4)
0.04
IIO
Input offset current
2
20
nA
IIB
Input bias current
4
pA
40
nA
VICR
Common-mode input voltage range
25
°
C
11
to
13
12
to
16
V
Full range
11
to
13
V
RL = 10 k
25
°
C
Full range
25
°
C
Full range
25
°
C
Full range
25
°
C
Full range
25
°
C
Full range
25
°
C
Full range
25
°
C
Full range
25
°
C
25
°
C
25
°
C
25
°
C
Full range
25
°
C
Full range
13
13.7
VOM+
Maximum positive peak output voltage swing
12.5
V
RL = 600
12.5
13.2
11
RL = 10 k
13
13.7
VOM
Maximum negative peak output voltage swing
12.5
V
RL = 600
12.5
13
11
VO =
±
10 V,
RL = 10 k
30
230
20
AVD
Large-signal differential voltage amplification
VO = 0 to 8 V,
RL = 600
25
100
V/mV
7
VO = 0 to 8 V,
RL = 600
3
25
1
ri
ci
zo
Input resistance
1012
pF
Input capacitance
4
Open-loop output impedance
IO = 0
560
CMRR
Common-mode rejection ratio
VIC = VICRmin,
RS = 50
72
90
dB
65
kSVR
Supply-voltage rejection ratio (
VCC
±
/
VIO)
RS = 50
75
65
93
dB
VCC
±
=
±
5 V to
±
15 V,
Full range is 55
°
C to 125
°
C.
NOTE 4: Typical values are based on the input offset voltage shift observed through 168 hours of operating life test at TA = 150
°
C extrapolated
to TA = 25
°
C using the Arrhenius equation and assuming an activation energy of 0.96 eV.
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