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參數(shù)資料
| 型號： | TISP7350F3 |
| 廠商： | Power Innovations International, Inc. |
| 英文描述： | Push-pull coupling, HRS unique design, Small and lightweight interface; HRS No: 110-0058-6 00; Shell Size (dia): 7; Operating Temperature Range (degrees C): -25 to 85; General Description: Accessory; Dust cap |
| 中文描述： | 三重雙向可控硅過電壓保護器 |
| 文件頁數(shù)： | 21/25頁 |
| 文件大小： | 489K |
| 代理商： | TISP7350F3 |
21
MARCH 1994 - REVISED MARCH 2000
TISP7125F3,TISP7150F3,TISP7180F3,TISP7240F3,TISP7260F3,
TISP7290F3,TISP7320F3,TISP7350F3,TISP7380F3
TRIPLEBIDIRECTIONALTHYRISTOROVERVOLTAGEPROTECTORS
P R O D U C T I N F O R M A T I O N
MECHANICAL DATA
D008
plastic small-outline package
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
5,21 (0.205)
4,60 (0.181)
NOTES: A. Leads are within 0,25 (0.010) radius of true position at maximum material condition.
B. Body dimensions do not include mold flash or protrusion.
C. Mold flash or protrusion shall not exceed 0,15 (0.006).
D. Lead tips to be planar within ±0,051 (0.002).
1,75 (0.069)
1,35 (0.053)
6,20 (0.244)
5,80 (0.228)
5,00 (0.197)
4,80 (0.189)
D008
8
7
6
5
4
3
2
1
4,00 (0.157)
3,81 (0.150)
7° NOM
3 Places
7° NOM
4 Places
0,51 (0.020)
0,36 (0.014)
8 Places
Pin Spacing
1,27 (0.050)
(see Note A)
6 Places
1,12 (0.044)
0,51 (0.020)
4° ± 4°
0,79 (0.031)
0,28 (0.011)
0,203 (0.008)
0,102 (0.004)
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
8-pin Small Outline Microelectronic Standard
Package MS-012, JEDEC Publication 95
0,50 (0.020)
0,229 (0.0090)
0,190 (0.0075)
MDXXAAC
INDEX
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TISP7350F3D | 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:MEDIUM & HIGH-VOLTAGE TRIPLE ELEMENT BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS |
| TISP7350F3DR | 功能描述:硅對稱二端開關(guān)元件 RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA |
| TISP7350F3DR-S | 功能描述:硅對稱二端開關(guān)元件 BI-DIRECTIONL PRTCTR 275volts RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA |
| TISP7350F3D-S | 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:MEDIUM & HIGH-VOLTAGE TRIPLE ELEMENT BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS |
| TISP7350F3SL | 功能描述:硅對稱二端開關(guān)元件 275V RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA |
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