參數(shù)資料
型號(hào)： THS8083-95CPZP
廠商： TEXAS INSTRUMENTS INC
元件分類： 消費(fèi)家電
英文描述： SPECIALTY CONSUMER CIRCUIT, PQFP100
封裝： POWER, THERMALLY ENHANCED, PLASTIC, TQFP-100
文件頁(yè)數(shù)： 51/61頁(yè)
文件大小： 239K
代理商： THS8083-95CPZP
6–1
6 Application Information
6.1
Designing With PowerPAD
The THS8083 is housed in a high-performance, thermally enhanced, 100-pin PowerPAD
package (TI package
designator: 100PZP). Use of the PowerPAD
package does not require any special considerations except to note
that the PowerPAD
, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical
conductor. Therefore, if not implementing the PowerPAD
PCB features, the use of solder masks (or other assembly
techniques) may be required to prevent any inadvertent shorting by the exposed PowerPAD
of connection etches
or vias under the package. The recommended option, however, is not to run any etches or signal vias under the
device, but to have only a grounded thermal land as explained below. Although the actual size of the exposed die
pad may vary, the minimum size required for the keepout area for the 100-pin PZP PowerPAD
package is
5 mm
× 5 mm.
It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the PowerPAD
package. The thermal land will vary in size, depending on the PowerPAD
package being used, the PCB
construction, and the amount of heat that needs to be removed. In addition, the thermal land may or may not contain
numerous thermal vias depending on PCB construction.
More information on this package and other requirements for using thermal lands and thermal vias are detailed in
the TI application note
PowerPAD
Thermally Enhanced Package Application Report, TI literature number
SLMA002, available via the TI Web pages beginning at URL: http://www.ti.com
For the THS8083, this thermal land should be grounded to the low impedance ground plane of the device. This
improves not only thermal performance but also the electrical grounding of the device. It is also recommended that
the device ground terminal landing pads be connected directly to the grounded thermal land. The land size should
be as large as possible without shorting device signal terminals. The thermal land may be soldered to the exposed
PowerPAD
using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is
recommended that the thermal land be connected to the low impedance ground plane for the device.
Table 6-1 lists a comparison for thermal resistances between the PowerPAD
package (100PZP) used for this device
and a regular 100-pin TQFP package.
Table 6–1. Junction-Ambient and Junction-Case Thermal Resistances
100 PZP PowerPAD
vs
AIRFLOW IN lfm
100 PZP PowerPAD
vs
100 PIN REGULAR TQFP
0
150
250
500
θJA (°C/W) 100 PZP
17.3
11.8
10.4
9.0
θJC (°C/W) 100 PZP
0.12
θJA (°C/W) 100 pin regular
49
θJC (°C/W) 100 pin regular
3
PowerPAD is a trademark of Texas Instruments.
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參數(shù)描述
THS8083A 制造商:TI 制造商全稱:Texas Instruments 功能描述:TRIPLE 8 BIT 80 MSPS 3.3V VIDEO AND GRAPHICS
THS8083A95 制造商:TI 制造商全稱:Texas Instruments 功能描述:TRIPLE 8-BIT, 95MSPS, 3.3V VIDEO AND GRAPHICS
THS8083A95PZP 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 Tr 8B 95MSPS 3.3V Vid & Graphics Dig RoHS:否 制造商:Texas Instruments 輸入信號(hào)類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
THS8083APZP 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 Triple 8B 80 MSPS 3.3V YUV/RGB RoHS:否 制造商:Texas Instruments 輸入信號(hào)類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel
THS8083APZP 制造商:Texas Instruments 功能描述:8BIT ADC 80MSPS TRIPLE SMD 8083
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