- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄383995 > THS4011MFK (Texas Instruments, Inc.) 290-MHz LOW-DISTORTION HIGH-SPEED AMPLIFIERS PDF資料下載
參數(shù)資料
| 型號： | THS4011MFK |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 290-MHz LOW-DISTORTION HIGH-SPEED AMPLIFIERS |
| 中文描述： | 290 - MHz的低失真高速放大器 |
| 文件頁數(shù)： | 20/30頁 |
| 文件大?。?/td> | 439K |
| 代理商： | THS4011MFK |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁當(dāng)前第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁
THS4011, THS4012
290-MHz LOW-DISTORTION HIGH-SPEED AMPLIFIERS
SLOS216B – JUNE 1999 – FEBRUARY 2000
20
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
circuit layout considerations
To achieve the levels of high frequency performance of the THS401x, follow proper printed-circuit board high
frequency design techniques. A general set of guidelines is given below. In addition, a THS401x evaluation
board is available to use as a guide for layout or for evaluating the device performance.
Ground planes – It is highly recommended that a ground plane be used on the board to provide all
components with a low inductive ground connection. However, in the areas of the amplifier inputs and
output, the ground plane can be removed to minimize the stray capacitance.
Proper power supply decoupling – Use a 6.8-
μ
F tantalum capacitor in parallel with a 0.1-
μ
F ceramic
capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers
depending on the application, but a 0.1-
μ
F ceramic capacitor should always be used on the supply terminal
of every amplifier. In addition, the 0.1-
μ
F capacitor should be placed as close as possible to the supply
terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less
effective. The designer should strive for distances of less than 0.1 inches between the device power
terminals and the ceramic capacitors.
Sockets – Sockets are not recommended for high-speed operational amplifiers. The additional lead
inductance in the socket pins will often lead to stability problems. Surface-mount packages soldered directly
to the printed-circuit board is the best implementation.
Short trace runs/compact part placements – Optimum high frequency performance is achieved when stray
series inductance has been minimized. To realize this, the circuit layout should be made as compact as
possible, thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting
input of the amplifier. Its length should be kept as short as possible. This will help to minimize stray
capacitance at the input of the amplifier.
Surface-mount passive components – Using surface-mount passive components is recommended for high
frequency amplifier circuits for several reasons. First, because of the extremely low lead inductance of
surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small
size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray
inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be
kept as short as possible.
general PowerPAD design considerations
The THS401x is available packaged in a thermally-enhanced DGN package, which is a member of the
PowerPAD family of packages. This package is constructed using a downset leadframe upon which the die is
mounted [see Figure 33(a) and Figure 33(b)]. This arrangement results in the lead frame being exposed as a
thermal pad on the underside of the package [see Figure 33(c)]. Because this thermal pad has direct thermal
contact with the die, excellent thermal performance can be achieved by providing a good thermal path away
from the thermal pad.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| THS4012D | 290-MHz LOW-DISTORTION HIGH-SPEED AMPLIFIERS |
| THS4012DGN | 290-MHz LOW-DISTORTION HIGH-SPEED AMPLIFIERS |
| THS4012EVM | 290-MHz LOW-DISTORTION HIGH-SPEED AMPLIFIERS |
| THS4021D | 350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4021DGN | 350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| THS4011MFKB | 制造商:Texas Instruments 功能描述:290-MHZ LOW-DISTORTION VOLTAGE-FEEDBACK |
| THS4011MJG | 制造商:Texas Instruments 功能描述:OP AMP SGL VOLT FDBK 16.5V/33V 8CDIP - Rail/Tube |
| THS4011MJGB | 制造商:Texas Instruments 功能描述:OP Amp Single Volt Fdbk ±16.5V/33V 8-Pin CDIP Tube 制造商:Texas Instruments 功能描述:OP AMP SGL VOLT FDBK 16.5V/33V 8CDIP - Rail/Tube |
| THS4012 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:290-MHz LOW-DISTORTION HIGH-SPEED AMPLIFIERS |
| THS4012CD | 功能描述:高速運(yùn)算放大器 Dual 290MHz RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。