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參數(shù)資料
| 型號： | TDA9321 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | I2C-bus controlled TV input processor |
| 中文描述： | 的I2C控制的電視處理器總線輸入 |
| 文件頁數(shù)： | 42/44頁 |
| 文件大?。?/td> | 249K |
| 代理商： | TDA9321 |
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1998 Dec 16
42
Philips Semiconductors
Preliminary specification
I
2
C-bus controlled TV input processor
TDA9321H
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
HLQFP, HSQFP, HSOP, SMS
PLCC
(3)
, SO
LQFP, QFP, TQFP
SQFP
SSOP, TSSOP, VSO
not suitable
(2)
suitable
not recommended
(3)(4)
not suitable
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TDA9321H | I2C-bus controlled TV input processor |
| TDA9330 | I2C-bus controlled TV display processors |
| TDA9330H | I2C-bus controlled TV display processors |
| TDA9331H | I2C-bus controlled TV display processors |
| TDA9332 | I2C-bus controlled TV display processors |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TDA9321H | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I2C-bus controlled TV input processor |
| TDA9330 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I2C-bus controlled TV display processors |
| TDA9330H | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I2C-bus controlled TV display processors |
| TDA9331H | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I2C-bus controlled TV display processors |
| TDA9332 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I2C-bus controlled TV display processors |
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