參數(shù)資料
型號(hào): STPCD0112BTC3
元件分類: 32位微控制器
英文描述: 32-Bit Microprocessor
中文描述: 32位微處理器
文件頁數(shù): 50/61頁
文件大?。?/td> 1007K
代理商: STPCD0112BTC3
MECHANICAL DATA
50/61
Issue 2.2 - October 13, 2000
5.2 388-Pin Package thermal data
388-pin PBGA package has a Power Dissipation
Capability of 4.5W which increases to 6W when
used with a Heatsink.
Structure in shown in
Figure 5-4
.
Thermal dissipation options are illustrated in
Fig-
ure 5-5
and
Figure 5-6
.
Figure 5-4. 388-Pin PBGA structure
Thermal balls
Power & Ground layers
Signal layers
Figure 5-5. Thermal dissipation without heatsink
Ambient
Board
Case
Junction
Board
Ambient
Ambient
Case
125
Junction
Board
Rca
Rjc
Rjb
Rba
6
6
8.5
Rja = 13 °C/W
Airflow = 0
Board temperature taken at the center balls
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centered on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17μm for internal layers
- 34μm for external layers
相關(guān)PDF資料
PDF描述
STPCD0113BTC3 32-Bit Microprocessor
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STPCI2GDYI PERIPHERAL (MULTIFUNCTION) CONTROLLER
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