參數(shù)資料
型號: STM32F103RB
廠商: 意法半導體
英文描述: Performance Line, ARM-based 32-bit MCU with Flash, USB, CAN,Seven 16-bit Timers, Two ADCs and Nine Communication interfaces(增強型,基于ARM內(nèi)核的32位 MCU,帶有Flash,USB,CAN,7個16位計時器,兩個ADC,兩個DAC和9個通信接口)
中文描述: 績效線,基于ARM的閃存,USB,加拿大,7 16 32位MCU位計時器,兩個ADC和9個通信接口(增強型,基于ARM的內(nèi)核的32位微控制器,帶有閃存,USB,加拿大,7個16位計時器,兩個模數(shù)轉換器,兩個DAC的和9個通信接口)
文件頁數(shù): 72/79頁
文件大?。?/td> 1124K
代理商: STM32F103RB
Package characteristics
STM32F103xx
6.1
Thermal characteristics
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using the
following equation:
TJ = TA + (PD x ΘJA)
(1)
Where:
TA is the Ambient Temperature in ° C,
Θ
JA is the Package Junction-to-Ambient Thermal Resistance, in ° C/W,
PD is the sum of PINT and PI/O (PD = PINT + PI/O),
PINT is the product of IDD and VDD, expressed in Watts. This is the Chip Internal Power.
PI/O represents the Power Dissipation on Input and Output Pins;
Most of the time for the application PI/O< PINT and can be neglected. On the other hand, PI/O
may be significant if the device is configured to drive continuously external modules and/or
memories.
An approximate relationship between PD and TJ (if PI/O is neglected) is given by:
PD = K / (TJ + 273 °C)
(2)
Therefore (solving equations 1 and 2):
K = PD x (TA + 273°C) + ΘJA x PD
2
(3)
where:
K is a constant for the particular part, which may be determined from equation (3) by
measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ
may be obtained by solving equations (1) and (2) iteratively for any value of TA.
Table 52.
Thermal characteristics
Symbol
Parameter
Value
Unit
Θ
JA
Thermal resistance junction-ambient
LFBGA100 - 10 x 10 mm / 0.5 mm pitch
41
°C/W
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
46
Thermal Resistance Junction-Ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
45
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
55
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相關代理商/技術參數(shù)
參數(shù)描述
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