參數(shù)資料
型號(hào): STM32F101CBT6XXX
廠商: STMICROELECTRONICS
元件分類: 微控制器/微處理器
英文描述: 32-BIT, FLASH, 36 MHz, RISC MICROCONTROLLER, PQFP48
封裝: 7 X 7 MM, ROHS COMPLIANT, LQFP-48
文件頁(yè)數(shù): 26/81頁(yè)
文件大?。?/td> 988K
代理商: STM32F101CBT6XXX
Electrical characteristics
STM32F101x8, STM32F101xB
Doc ID 13586 Rev 12
5.3.2
Operating conditions at power-up / power-down
Subject to general operating conditions for TA.
Table 9.
Operating conditions at power-up / power-down
5.3.3
Embedded reset and power control block characteristics
The parameters given in Table 10 are derived from tests performed under the ambient
temperature and VDD supply voltage conditions summarized in Table 8.
P
D
Power dissipation at TA =
85 °C(3)
LQFP100
434
mW
LQFP64
444
LQFP48
363
VFQFPN36
1110
TA
Ambient temperature
Maximum power dissipation
–40
85
°C
Low power dissipation(4)
–40
105
°C
TJ
Junction temperature range
–40
105
°C
1.
When the ADC is used, refer to Table 41: ADC characteristics.
2.
It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV
between VDD and VDDA can be tolerated during power-up and operation.
3.
If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.2: Thermal
4.
In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see
Table 8.
General operating conditions (continued)
Symbol
Parameter
Conditions
Min
Max
Unit
Symbol
Parameter
Conditions
Min
Max
Unit
tVDD
VDD rise time rate
0
s/V
VDD fall time rate
20
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