
SN54ALVTH16374, SN74ALVTH16374
2.5-V/3.3-V 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCES068A – JUNE 1996 – REVISED JULY 1996
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
description (continued)
The SN74ALVTH16374 is available in TI’s thin very small-outline package (DGV), which provides the same I/O
pin count and functionality of standard Widebus packages in less than half the printed circuit board area.
The SN54ALVTH16374 is characterized for operation over the full military temperature range of –55
°
C to
125
°
C. The SN74ALVTH16374 is characterized for operation from –40
°
C to 85
°
C.
FUNCTION TABLE
(each 8-bit section)
INPUTS
CLK
↑
↑
H or L
OUTPUT
Q
OE
D
L
H
H
L
L
L
L
X
Q0
Z
H
X
X
logic diagram (positive logic)
48
47
1OE
1
1CLK
1D1
To Seven Other Channels
2
1Q1
C1
1D
25
36
2OE
24
2CLK
2D1
13
2Q1
C1
1D
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
CC
Input voltage range, V
I
(see Note 1)
Voltage range applied to any output in the high state or power-off state, V
O
(see Note 1)
Output current in the low state, I
O
:SN54ALVTH16374
SN74ALVTH16374
Output current in the high state, I
O
: SN54ALVTH16374
SN74ALVTH16374
Input clamp current, I
IK
(V
I
< 0)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, I
OK
(V
O
< 0)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation at T
A
= 55
°
C (in still air) (see Note 2):DGG package
–0.5 V to 4.6 V
–0.5 V to 7 V
–0.5 V to 7 V
. . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
96 mA
128 mA
–48 mA
–64 mA
–50 mA
–50 mA
0.85 W
0.87 W
1.2 W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . .
DGV package
DL package
Storage temperature range, T
stg
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150
°
C and a board trace length of 750 mils.
For more information, refer to the Package Thermal Considerationsapplication note in the ABT Advanced BiCMOS Technology Data
Book
–65
°
C to 150
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
P