
15
360/440/480MHz CPU; 0.25 to 2 MB L2 cache, UPA64S, 66MHz PCI
UltraSPARC-IIi CPU Module
March 1999
Sun Microsystems, Inc
SME5431PCI-360
SME5434PCI-440
SME5434PCI-480
Preliminary
SPECIFICATIONS
Absolute Maximum Ratings [1] [2]
1. Operation of the device at values exceeding those listed may result in degradation or destruction of the device. Functional operation of the device
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. Unless otherwise noted, all voltages are with respect to VSS.
Symbol
Parameter
Conditions
Rating
Unit
VDD
Supply voltage range for I/O
–
0 to 3.8
V
VDD_CORE
Supply voltage range for CPU core
–
0 to 2.2 [3]
3. VDD_CORE voltage must be lower than VDD except for power cycling when VDD can be lower than VDD_CORE for 30 ms or less when the current is
limited to twice the maximum rating for the CPU.
V
VI
Input voltage range
–
Vss - 0.5 < VI < VDD +0.5
V
VO
Output voltage range
–
Vss - 0.5 < VO < VDD +0.5
V
IIK
Input clamp current
VI < 0 - 0.5V or VI > VDD + 0.5V
20
mA
IOK
Output clamp current
VI < 0 - 0.5V or VI > VDD + 0.5V
±50
mA
IOL
Current into any output in the low
state
–50
mA
–
Shock [4]
4. These specications are for the module assembly alone and do not apply to the module connectors when installed in a system board. Sun uses
an attachment device for the module in such an installation.
in any axis
15
g
–
peak value in any axis and within
spectral range 5
≤ f ≤ 500 Hz
0.25
g
Recommended Operating Conditions [1]
Symbol
Parameter
Condition
Min
Typ
Max
Unit
VDD
Supply voltage for I/O
–
3.14
3.3
3.46
V
VDD_CORE Supply voltage for the CPU
core
–
1.84
1.90
1.96
V
IOH
High-level output current
–
-4.0
mA
IOL
Low-level output current
–
8.0
mA
TJ
Operating junction
temperature [2]
2. Junction temperature can be calculated based upon heat sink or case-temperature
measurements; see page 21.
––
–
85
°C
TA
Operating ambient
temperature
–
0
–
see
notes [3]
3. Maximum allowable ambient temperature depends upon air ow rate and must be chosen so that the maximum junction temperature TJ is not
°C
–
Airow through heatsink
(360 MHz, 440 MHz, and
480 MHz CPU)
inlet at 30
°C and sea-level altitude
–
150
ft./min
inlet at 45
°C and 10,000 ft. altitude [4]
4. The increased air ow accounts for a 25% increased heatsink-to-air thermal resistance,
θ
Si, for 10,000ft altitude and higher air temperature.
Always measure operating temperature to validate airow design.
–
300
ft./min