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參數(shù)資料
| 型號： | SC627ULTRT |
| 廠商： | Semtech Corporation |
| 英文描述： | LED Light Management Unit Charge Pump, 4 LEDs, 700mA Flash LED, Dual LDOs, and SemWireTM Interface |
| 中文描述： | LED燈管理股電荷泵，4個LED，700mA的閃光LED，雙LDO，和SemWireTM接口 |
| 文件頁數(shù)： | 16/23頁 |
| 文件大小： | 371K |
| 代理商： | SC627ULTRT |
SC627
16
PCB Layout Considerations
The layout diagram in Figure 1 illustrates a proper
two-layer PCB layout for the SC627 and supporting
components. Following fundamental layout rules is
critical for achieving the performance specified in the
Electrical Characteristics table. The following guidelines
are recommended when developing a PCB layout:
Place all bypass and decoupling capacitors —
C1, C2, CIN, COUT, CLDO1, CLDO2, and CBYP as
close to the device as possible.
All charge pump current passes through VIN,
VOUT, and the bucket capacitor connection
pins. Ensure that all connections to these pins
make use of wide traces so that the resistive
drop on each connection is minimized.
The thermal pad should be connected to the
ground plane using multiple vias to ensure
proper thermal connection for optimal heat
transfer.
Applications Information (continued)
Make all ground connections to a solid
ground plane as shown in the example layout
(Figure 3).
If a ground layer is not feasible, the following
groupings should be connected:
PGND — CIN, COUT
AGND — Ground Pad, CLDO1, CLDO2,
CBYP
If no ground plane is available, PGND and
AGND should be routed back to the negative
battery terminal as separate signals using thick
traces. Joining the two ground returns at the
terminal prevents large pulsed return currents
from mixing with the low-noise return currents
of the LDOs.
Both LDO output traces should be made as
wide as possible to minimize resistive losses.
COUT
C1
C2
CIN
CBYP
CLDO2
BL1
BL2
B
LDO1
LDO2
BYP
C
C2-
V
C
C
V
SWIF
A
G
B
V
V
SC627
F
FL
GND
CLDO1
GND
PGND
NC
Figure 1 — Recommended PCB Layout
Figure 2 — Layer 1
Figure 3 — Layer 2
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