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參數資料
| 型號： | SC488 |
| 廠商： | Semtech Corporation |
| 英文描述： | Complete DDR1/2/3 Memory Power Supply |
| 中文描述： | 完全DDR1/2/3內存供電 |
| 文件頁數： | 2/24頁 |
| 文件大小： | 818K |
| 代理商： | SC488 |
2
2006 Semtech Corp.
www.semtech.com
POWER MANAGEMENT
Absolute Maximum Ratings
SC488
Electrical Characteristics
Exceeding the speci
fi
cations below may result in permanent damage to the device or device malfunction. Operation outside of the parameters speci
fi
ed in the
Electrical Characteristics section is not implied. Exposure to absolute maximum rated conditions for extended periods of time may affect device reliability.
Test Conditions: V
IN
= 15V, VCCA = VDDP = VTTEN = EN/PSV = 5V, VDDQ = VTTIN = 1.8V, R
TON
= 1M
Ω
. T
AMB
= -40 TO +85C.
Parameter
Symbol
Maximum
Units
TON to VSSA
-0.3 to +25.0
V
DH, BST to PGND1
-0.3 to +31.0
V
BST, DH to LX
-0.3 to +6.0
V
LX to PGND1
-2.0 to +25.0
V
DL, ILIM, VDDP to PGND1
-0.3 to +6.0
V
VDDP to DL
-0.3 to +6.0
V
VTTIN to PGND2; VTT to PGND2; VTTIN to VTT
-0.3 to +6.0
V
EN/PSV, FB, PGD, REF, VCCA, VDDQS, VTTEN, VTTS to VSSA
-0.3 to +6.0
V
VCCA to EN/PSV, FB, REF, VDDQS, VTT, VTTEN, VTTIN, VTTS
-0.3 to +6.0
V
PGND1 to PGND2; PGND1 to VSSA; PGND2 to VSSA
-0.3 to +0.3
V
Thermal Resistance Junction to Ambient
(1)
θ
JA
29
°C/W
Operating Junction Temperature Range
T
J
-40 to +150
°C
Storage Temperature Range
T
STG
-65 to +150
°C
Peak IR Re
fl
ow Temperature, 10s - 40s
T
PKG
260
°C
ESD Protection Level
(2)
V
ESD
2
kV
Parameter
Conditions
25°C
-40°C to 85°C
Units
Min
Typ
Max
Min
Max
Input Supplies
VCCA Operating Current
S0 State (VTT on); EN/PSV = VCCA;
FB > Regulation Point, IVDDQ = 0A
1500
2500
μ
A
VCCA Operating Current
S3 State (VTT off); EN/PSV = VCCA;
FB > Regulation Point, IVDDQ = 0A
800
1400
μ
A
VCCA Operating Voltage
5
4.5
5.5
V
VDDP Operating Current
FB > Regulation Point, IVDDQ = 0A
70
150
μ
A
TON Operating Current
RTON = 1M
Ω
15
μ
A
VTTIN Operating Current
IVTT = 0A
1
5
μ
A
VCCA + VDDP + TON
Shutdown Current
EN/PSV = VTTEN = 0V
5
22
μ
A
VTTIN Shutdown Current
EN/PSV = VTTEN = 0V
1
μ
A
Notes:
1) Calculated from package in still air, mounted to 3” x 4.5”, 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards.
2) Tested according to JEDEC standard JESD22-A114-B.
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