- 您現在的位置：買賣IC網 > PDF目錄3765 > SC16IS752IBS,151 (NXP Semiconductors)IC UART DUAL I2C/SPI 32-HVQFN PDF資料下載
參數資料
| 型號： | SC16IS752IBS,151 |
| 廠商： | NXP Semiconductors |
| 文件頁數： | 51/60頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC UART DUAL I2C/SPI 32-HVQFN |
| 產品培訓模塊： | Bridge Solutions Stand-Alone UARTs I²C Bus Fundamentals |
| 特色產品： | NXP - I2C Interface |
| 標準包裝： | 490 |
| 特點： | 低電流 |
| 通道數： | 2，DUART |
| FIFO's： | 64 字節(jié) |
| 規(guī)程： | RS232，RS485 |
| 電源電壓： | 2.5V, 3.3V |
| 帶自動流量控制功能： | 是 |
| 帶IrDA 編碼器/解碼器： | 是 |
| 帶故障啟動位檢測功能： | 是 |
| 帶調制解調器控制功能： | 是 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-VFQFN 裸露焊盤 |
| 供應商設備封裝： | 32-HVQFN（5x5） |
| 包裝： | 托盤 |
| 產品目錄頁面： | 828 (CN2011-ZH PDF) |
| 配用： | 568-4000-ND - DEMO BOARD SPI/I2C TO DUAL UART 568-3510-ND - DEMO BOARD SPI/I2C TO UART |
| 其它名稱： | 568-2236 935279288151 SC16IS752IBS-S |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁當前第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁
SC16IS752_SC16IS762
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 9 — 22 March 2012
55 of 60
NXP Semiconductors
SC16IS752; SC16IS762
Dual UART with I2C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 39) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 40 and 41
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 39.
Table 40.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
Table 41.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相關PDF資料 |
PDF描述 |
|---|---|
| SC16IS752IPW,112 | IC UART DUAL 12C/SPI 28TSSOP |
| SC16C850IBS,151 | IC UART SGL-CH 3.3V 32-HVQFN |
| SC16IS760IPW,112 | IC UART 64BYTE 24TSSOP |
| FT2232HL-REEL | IC USB HS DUAL UART/FIFO 64-LQFP |
| ATMEGA168P-20AUR | MCU AVR 16K FLASH 20MHZ 32-TQFP |
相關代理商/技術參數 |
參數描述 |
|---|---|
| SC16IS752IBS-F | 功能描述:UART 接口集成電路 I2C/SPI-UARTBRIDGE W/IRDA AND GPIO RoHS:否 制造商:Texas Instruments 通道數量:2 數據速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16IS752IPW | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Dual UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support |
| SC16IS752IPW,112 | 功能描述:UART 接口集成電路 UART DUAL 12C/SPI RoHS:否 制造商:Texas Instruments 通道數量:2 數據速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16IS752IPW,128 | 功能描述:UART 接口集成電路 I2C/SPI-UARTBRIDGE RoHS:否 制造商:Texas Instruments 通道數量:2 數據速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16IS752IPW112 | 制造商:NXP Semiconductors 功能描述:IC DUAL UART FIFO 5MBPS 3.6V TSSOP28 |
發(fā)布緊急采購，3分鐘左右您將得到回復。