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參數(shù)資料
| 型號： | SC16C550BIBS,157 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 39/48頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC UART SOT617-1 |
| 標(biāo)準(zhǔn)包裝： | 2,450 |
| 特點(diǎn)： | 可編程 |
| 通道數(shù)： | 1，UART |
| FIFO's： | 16 字節(jié) |
| 電源電壓： | 2.5V，3.3V，5V |
| 帶自動流量控制功能： | 是 |
| 帶故障啟動位檢測功能： | 是 |
| 帶調(diào)制解調(diào)器控制功能： | 是 |
| 帶CMOS： | 是 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-VFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 32-HVQFN（5x5） |
| 包裝： | 托盤 |
| 其它名稱： | 935279497157 SC16C550BIBS SC16C550BIBS-ND |
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SC16C550B_5
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 1 October 2008
44 of 48
NXP Semiconductors
SC16C550B
5 V, 3.3 V and 2.5 V UART with 16-byte FIFOs
For further information on temperature proles, refer to Application Note
AN10365
“Surface mount reow soldering description”.
13. Soldering of through-hole mount packages
13.1 Introduction to soldering through-hole mount packages
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
13.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250
°C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specied maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
13.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300
°C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300
°C and 400 °C, contact may be up to 5 seconds.
MSL: Moisture Sensitivity Level
Fig 28. Temperature proles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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| XR17C158CV-F | IC UART PCI BUS 5V OCTAL 144LQFP |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SC16C550BIBS-F | 功能描述:UART 接口集成電路 16CB 2.5V-5V 1CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C550BIBS-S | 功能描述:UART 接口集成電路 16CB 2.5V-5V 1CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C550BIN40 | 制造商:NXP Semiconductors 功能描述:UART 16BYTE FIFO 16C550 DIP40 |
| SC16C550BIN40,112 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 1CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C550IA44 | 制造商:NXP Semiconductors 功能描述:UART 16BYTE FIFO 16C550 PLCC44 |
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