參數(shù)資料
型號(hào)： SAK-XC2232N-24F40L
廠商： INFINEON TECHNOLOGIES AG
元件分類： 微控制器/微處理器
英文描述： 16-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PQFP64
封裝： 0.50 MM PITCH, GREEN, PLASTIC, LQFP-64
文件頁數(shù)： 10/110頁
文件大?。?/td> 1601K
代理商： SAK-XC2232N-24F40L
XC2232N, XC2234N, XC2236N, XC2238N
XC2000 Family / Value Line
Package and Reliability
Data Sheet
107
V1.3, 2010-04
5
Package and Reliability
The XC2000 Family devices use the package type PG-LQFP (Plastic Green - Low
Profile Quad Flat Package). The following specifications must be regarded to ensure
proper integration of the XC223xN in its target environment.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package Compatibility Considerations
The XC223xN is a member of the XC2000 Family of microcontrollers. It is also
compatible to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Table 38
Package Parameters (PG-LQFP-64-6)
Parameter
Symbol
Limit Values
Unit Notes
Min.
Max.
Exposed Pad Dimension
Ex
× Ey –
5.6
× 5.6
mm
–
Power Dissipation
P
DISS
–0.8
W
–
Thermal resistance
Junction-Ambient
RΘJA
–
40
K/W No thermal via
1)
1) Device mounted on a 4-layer board without thermal vias; exposed pad not soldered.
37
K/W 4-layer, no pad
2)
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
soldered.
25
K/W 4-layer, pad
3)
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
to the board.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SAK-XC2232N-40F80LAA 制造商:Infineon Technologies AG 功能描述:
SAK-XC2234L-20F66L AA 功能描述:16位微控制器 - MCU 16/32b Sngl Chip MCU 32Bit Perform 66MHz RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
SAK-XC2236N-16F66LAA 制造商:Infineon Technologies AG 功能描述:
SAK-XC2236N-24F40L 功能描述:16位微控制器 - MCU 16 BIT FLASH RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
SAK-XC2236N-24F40L AA 功能描述:16位微控制器 - MCU 16-Bit Single-Chip MCU w/32 Bit Perform RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
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