參數(shù)資料
型號(hào): S8865-64
廠商: Hamamatsu Photonics
英文描述: Photodiode array combined with signal processing circuit chip
中文描述: 光電二極管陣列結(jié)合信號(hào)處理集成電路芯片
文件頁數(shù): 6/6頁
文件大?。?/td> 175K
代理商: S8865-64
HAMAMATSU PHOTONICS K.K., Solid State Division
1126-1 Ichino-cho,
Higashi-ku,
Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184, http://www.hamamatsu.com
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, P.O.Box 6910, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 08152-3750, Fax: (49) 08152-2658
France: Hamamatsu Photonics France S.A.R.L.:
19
, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777
North Europe: Hamamatsu Photonics Norden AB: Smidesv
gen 12, SE-171 41 Solna, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01
Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1/E, 20020 Arese, (Milano), Italy, Telephone: (39) 02-935-81-733, Fax: (39) 02-935-81-741
6
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. 200
4
Hamamatsu Photonics K.K.
Cat. No. KMPD1071E01
Jan
. 200
4
DN
Photodiode array with amplifier
S8865 series
I
Cautions during use
(1) The signal processing circuit chips of S8865 series are protected against static electricity. However, in order to prevent
possible damage to the chip, implement electrostatic countermeasures such as grounding of the operator, work table and
tools. Furthermore, the devices must be protected against surge voltages from external equipment.
(2) Since the photodiode array chip is not protected, handle it carefully so it will not become contaminated or scratched.
Photodiode array performance may deteriorate if operated at high temperatures and humidity, so the housing should be
designed to be airtight. The signal processing circuit chip and its wire bonding are covered with a resin coating for
protection, but never touch these portions. In addition, take care when installing the board so that it does not warp.
(3) S8865-64G, -128G
Signal processing IC chip performance will drop if subjected to X-rays. Protect the IC chip from X-rays by installing a lead
shield.
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