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參數(shù)資料
| 型號(hào)： | S71GL064A08BFW0B0 |
| 廠商： | SPANSION LLC |
| 元件分類(lèi)： | 存儲(chǔ)器 |
| 英文描述： | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA56 |
| 封裝： | 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 |
| 文件頁(yè)數(shù)： | 88/102頁(yè) |
| 文件大?。?/td> | 1606K |
| 代理商： | S71GL064A08BFW0B0 |
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88
S71GL032A Based MCPs
S71GL032A_00_A0 March 31, 2005
A d v a n c e I n f o r m a t i o n
Notes:
1.
2.
If Chip Enable goes Inactive simultaneously with WE# = High, the output remains in a high-impedance state.
During the Don’t Care period in the Data I/O waveform, the I/Os are in output state and input signals should not be applied.
Notes:
1.
2.
If Chip Enable goes Inactive simultaneously with WE# = High, the output remains in a high-impedance state.
During the Don’t Care period in the Data I/O waveform, the I/Os are in output state and input signals should not be applied.
Figure 30. Write Cycle 3 (WE# Controlled, OE# Low)
Figure 31. Write Cycle 4 (BHE#/BLE# Controlled, OE# Low)
VALID DATA
t
HD
t
SD
t
LZWE
t
PWE
t
SA
t
HA
t
AW
t
SCE
t
WC
t
HZWE
ADDRESS
CE
2
DATA I/O
t
BW
DON’T CARE
CE#1
BHE#/BLE#
WE#
CE#1
CE2
BHE#/BLE#
WE#
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相關(guān)代理商/技術(shù)參數(shù) |
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| S71GL064A08BFW0B2 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A08BFW0B3 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A08BFW0F0 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A08BFW0F2 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A08BFW0F3 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
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