- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄385801 > S29GL128M90TAIR83 (Spansion Inc.) 3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology PDF資料下載
參數(shù)資料
| 型號： | S29GL128M90TAIR83 |
| 廠商： | Spansion Inc. |
| 英文描述： | 3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology |
| 中文描述： | 3.0伏只頁面模式閃存具有0.23微米工藝技術(shù)的MirrorBit |
| 文件頁數(shù)： | 103/160頁 |
| 文件大?。?/td> | 2142K |
| 代理商： | S29GL128M90TAIR83 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁當(dāng)前第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁第127頁第128頁第129頁第130頁第131頁第132頁第133頁第134頁第135頁第136頁第137頁第138頁第139頁第140頁第141頁第142頁第143頁第144頁第145頁第146頁第147頁第148頁第149頁第150頁第151頁第152頁第153頁第154頁第155頁第156頁第157頁第158頁第159頁第160頁
April 30, 2004 S29GLxxxM_00A5
S29GLxxxM MirrorBit
TM
Flash Family
103
P r e l i m i n a r y
Autoselect Command Sequence
The autoselect command sequence allows the host system to read several iden-
tifier codes at specific addresses:
Note:
The device ID is read over three cycles. SA = Sector Address
The autoselect command sequence is initiated by first writing two unlock cycles.
This is followed by a third write cycle that contains the autoselect command. The
device then enters the autoselect mode. The system may read at any address any
number of times without initiating another autoselect command sequence:
The system must write the reset command to return to the read mode (or erase-
suspend-read mode if the device was previously in Erase Suspend).
Enter SecSi Sector/Exit SecSi Sector Command Sequence
The SecSi Sector region provides a secured data area containing an 8-word/16-
byte random Electronic Serial Number (ESN). The system can access the SecSi
Sector region by issuing the three-cycle Enter SecSi Sector command sequence.
The device continues to access the SecSi Sector region until the system issues
the four-cycle Exit SecSi Sector command sequence. The Exit SecSi Sector com-
mand sequence returns the device to normal operation. Table
31
and Table
32
show the address and data requirements for both command sequences. See also
“SecSi (Secured Silicon) Sector Flash Memory Region” for further information.
Note that the ACC function and unlock bypass modes are not available when the
SecSi Sector is enabled.
Word Program Command Sequence
Programming is a four-bus-cycle operation. The program command sequence is
initiated by writing two unlock write cycles, followed by the program set-up com-
mand. The program address and data are written next, which in turn initiate the
Embedded Program algorithm. The system is not required to provide further con-
trols or timings. The device automatically provides internally generated program
pulses and verifies the programmed cell margin. Tables 31 and 32 show the ad-
dress and data requirements for the word program command sequence,
respectively.
When the Embedded Program algorithm is complete, the device then returns to
the read mode and addresses are no longer latched. The system can determine
the status of the program operation by using DQ7 or DQ6. Refer to the Write Op-
eration Status section for information on these status bits. Any commands
written to the device during the Embedded Program Algorithm are ignored.
Note
that the SecSi Sector, autoselect, and CFI functions are unavailable when a pro-
gram operation is in progress.
Note that a
hardware reset
immediately
terminates the program operation. The program command sequence should be
Identifier Code
A7:A0
(x16)
A6:A-1
(x8)
Manufacturer ID
00h
00h
Device ID, Cycle 1
01h
02h
Device ID, Cycle 2
0Eh
1Ch
Device ID, Cycle 3
0Fh
1Eh
SecSi Sector Factory Protect
03h
06h
Sector Protect Verify
(SA)02h
(SA)04h
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S29GL128M90TDIR10 | 3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology |
| S29GL128M90TDIR12 | 3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology |
| S29GL128M90TDIR13 | 3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology |
| S29GL128M90TDIR20 | 3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology |
| S29GL128M90TDIR22 | 3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S29GL128M90TFIR10 | 制造商:Spansion 功能描述:Flash Mem Parallel 3V/3.3V 128M-Bit 16M x 8/8M x 16 90ns 56-Pin TSOP Tray |
| S29GL128N10FFI010 | 制造商:Spansion 功能描述:NOR Flash Parallel 3V/3.3V 128Mbit 16M/8M x 8bit/16bit 100ns 64-Pin Fortified BGA Tray 制造商:Spansion 功能描述:MIRRORBIT FLASH 128MB SMD 29LV128 |
| S29GL128N10FFI020 | 制造商:Spansion 功能描述:Flash - NOR IC |
| S29GL128N10TF101 | 制造商:Spansion 功能描述: |
| S29GL128N10TFI010 | 功能描述:IC FLASH 制造商:cypress semiconductor corp 系列:GL-N 包裝:托盤 零件狀態(tài):在售 存儲器類型:非易失 存儲器格式:閃存 技術(shù):FLASH - NOR 存儲容量:128Mb （16M x 8，8M x 16） 寫周期時間 - 字，頁:100ns 訪問時間:100ns 存儲器接口:并聯(lián) 電壓 - 電源:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C（TA） 安裝類型:表面貼裝 封裝/外殼:56-TFSOP（0.724"，18.40mm 寬） 供應(yīng)商器件封裝:56-TSOP 標(biāo)準(zhǔn)包裝:91 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。