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Mobile Intel
Pentium
III Processor-M Datasheet
70
Datasheet
298340-002
6.
V
CC
Thermal Specifications
In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat pipe, or
other heat transfer system) must make firm contact to the exposed processor die. The processor die
Table 41 provides the Thermal Design Power (TDP) dissipation and the minimum and maximum T
J
temperatures for the Mobile Intel Pentium III Processor-M. The thermal solution should be designed
to ensure the junction temperature never exceeds the 100
°
C T
J
specification while operating at the
Thermal Design Power. Additionally, a secondary failsafe mechanism in hardware should be provided
to shutdown the processor at 101
°
C to prevent permanent damage, as described in Section 3.1.3. TDP
is a thermal design power specification based on the worst case power dissipation of the processor
while executing publicly available software under normal operating conditions at nominal voltages.
Contact your Intel Field Sales Representative for further information.
Table 41. Power Specifications
for Mobile Intel Pentium III Processor-M
Symbol
Core Frequency/Voltage
Thermal Design
Power
Unit
Notes
TDP
Thermal Design Power at
300 MHz & 0.95V
450 MHz & 1.05V
466 MHz & 1.05V
500 MHz & 1.05V
533 MHz & 1.05V
700 MHz & 1.10V
667 MHz & 1.15V
733 MHz & 1.15V
750 MHz & 1.15V
800 MHz & 1.15V
866 MHz & 1.40V
933 MHz & 1.40V
1000 MHz & 1.40V
1066 MHz & 1.40V
1133 MHz & 1.40V
1200 MHz & 1.40V
3.0
5.7
5.8
5.9
6.1
7.0
8.9
9.3
9.4
9.8
19.5
20.1
20.5
21.0
21.8
22.0
W
At 100°C, Note 1
Notes 1, 4
Notes 1, 4
Symbol
Parameter
Min
Max
Unit
Notes
P
AH
Auto Halt power at
0.95V
1.05V
1.10V
1.15V
1.40V
1.0
2.0
1.9
3.0
7.0
W
At 50°C, Note 2
Note 2, 4
Notes 2, 4
P
QS
Quick Start power at
0.95V
1.05V
1.10V
1.15V
1.40V
0.9
1.8
1.7
2.7
6.5
W
At 50°C, Note 2
Notes 2, 4
Notes 2, 4