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參數(shù)資料
| 型號： | RD38F1010C0ZBL0 |
| 廠商： | INTEL CORP |
| 元件分類： | 存儲器 |
| 英文描述： | CAPACITOR, BESTCAP 33 MILLI FARAD 7V CAPACITOR, BESTCAP 33 MILLI FARAD 7V; CAPACITANCE:33MF; VOLTAGE RATING, DC:7V; CAPACITOR DIELECTRIC TYPE:ELECTRONIC; SERIES:BESTCAP; TEMP, OP. MAX:75(DEGREE C); TEMP, OP. MIN:-20(DEGREE C); RoHS Compliant: Yes |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA66 |
| 封裝： | 8 X 10 MM, 1.20 MM HEIGHT, SCSP-66 |
| 文件頁數(shù)： | 4/70頁 |
| 文件大?。?/td> | 1223K |
| 代理商： | RD38F1010C0ZBL0 |
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Contents
4
Datasheet
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
DCCharacteristics..............................................................................................................26
FlashACCharacteristics....................................................................................................29
FlashACCharacteristics—WriteOperations......................................................................31
FlashEraseandProgramTimings(1).................................................................................31
FlashResetOperations......................................................................................................34
SRAMACCharacteristics—ReadOperations....................................................................35
SRAMACCharacteristics—WriteOperations....................................................................37
SRAMDataRetentionCharacteristics—ExtendedTemperature.......................................39
6.0
MigrationGuideInformation
......................................................................................................40
7.0
SystemDesignConsiderations
..................................................................................................41
7.1
Background.........................................................................................................................41
7.1.1
Flash+SRAMFootprintIntegration ......................................................................41
7.1.2
Advanced+BootBlockFlashMemoryFeatures ...................................................41
7.2
FlashControlConsiderations .............................................................................................41
7.2.1
F-RP#ConnectedtoSystemReset.......................................................................42
7.2.2
F-VCC,F-VPPandF-RP#Transition....................................................................42
7.3
NoiseReduction .................................................................................................................43
7.4
SimultaneousOperation.....................................................................................................44
7.4.1
SRAMOperationduringFlash“Busy” ...................................................................45
7.4.2
SimultaneousBusOperations ...............................................................................45
7.5
PrintedCircuitBoardNotes................................................................................................45
7.6
SystemDesignNotesSummary.........................................................................................45
AppendixAProgram/EraseFlowcharts
.............................................................................................46
AppendixBCFIQueryStructure
........................................................................................................52
AppendixCWord-WideMemoryMapDiagrams
...............................................................................59
AppendixDDeviceIDTable
................................................................................................................62
AppendixEProtectionRegisterAddressing
.....................................................................................63
AppendixFMechanicalandShippingMediaDetails
........................................................................64
AppendixGAdditionalInformation
....................................................................................................68
AppendixHOrderingInformation
.......................................................................................................69
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| RD38F1010C0ZTL0 | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:3 VOLT INTEL Advanced+ Boot Block Flash Memory (C3) Stacked-Chip ScalPackage Familye |
| RD38F1010W0YBQ0 | 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:Wireless Flash Memory (W18/W30 SCSP) |
| RD38F1010W0YDQ0 | 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:Wireless Flash Memory (W18/W30 SCSP) |
| RD38F1010W0YTQ0 | 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:Wireless Flash Memory (W18/W30 SCSP) |
| RD38F1010W0ZBQ0 | 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:Wireless Flash Memory (W18/W30 SCSP) |
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