- 您現(xiàn)在的位置：買賣IC網 > PDF目錄299768 > PF38F3352LLZDQ0 (INTEL CORP) SPECIALTY MEMORY CIRCUIT, PBGA88 PDF資料下載
參數資料
| 型號： | PF38F3352LLZDQ0 |
| 廠商： | INTEL CORP |
| 元件分類： | 存儲器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA88 |
| 封裝： | 11 X 13 MM, SCSP-88 |
| 文件頁數： | 51/54頁 |
| 文件大小： | 966K |
| 代理商： | PF38F3352LLZDQ0 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁當前第51頁第52頁第53頁第54頁
768-Mbit LVQ Family with Asynchronous Static RAM
6
Datasheet
Non-Array Reads
Flash reads which return flash Device Identifier, CFI Query, Protection
Register and Status Register information
Program
An operation to Write data to the flash array
Write
Bus cycle operation at the inputs of the flash die, in which a command
or data are sent to the flash array
Block
Group of cells, bits, bytes or words within the flash memory array that
get erased with one erase instruction
Parameter block
Any 16-Kword flash array block.
Main block
Any 64-Kword flash array block.
Top parameter
Previously referred to as a top-boot device, a device with flash
parameter partition located at the highest physical address of its
memory map for processor system boot up.
Bottom parameter
Previously referred to as a bottom-boot device, a device with flash
parameter partition located at the lowest physical address of its memory
map for processor system boot up.
Bottom-Top parameter
Stacked-CSP device configuration of two flash dies in the same
segment arranged with the parameter partitions located at the lowest
and highest physical address of its memory map.
Partition
A group of flash blocks that shares common status register read state.
Parameter partition
A flash partition containing parameter and main blocks.
Main partition
A flash partition containing only main blocks.
Die
Individual physical flash die used in a stacked-CSP memory subsystem
device
Segment
A section of the SCSP memory subsystem divided for different
operating characteristics. The SCSP memory subsystem has three
segments: a code segment, a data segment, and an xRAM segment.
Code segment
A segment that contains one or two flash memory dies optimized for
fast code or data reads. Each die features multi-partition synchronous
read-while-write or burst read-while-erase capability.
Data segment
A segment contains one or two flash memory dies optimized for large
embedded data. Each die feature single-partition asynchronous read,
write, and erase operations.
xRAM segment
A segment contains one or two xRAM memory dies. The xRAM
combinations could include SRAM, PSRAM, or LPSDRAM.
Subsystem
A stacked memory integration concept made up of multiple memory
dies arranged in Code, Data, and xRAM segments.
Device
An individual flash die or a flash + xRAM SCSP.
相關PDF資料 |
PDF描述 |
|---|---|
| PF38F40L0YUQ0 | 16M X 16 FLASH 1.8V PROM, PBGA88 |
| PF50WIW2K-3.5VF-W6 | SINGLE COLOR LED, INCAND WHITE |
| PD50WO3K-28V-T | SINGLE COLOR LED, SUPER ORANGE |
| PD50WR3K-24V-W6 | SINGLE COLOR LED, ULTRA RED |
| PF50WAG6K-240VAC-W6 | SINGLE COLOR LED, AQUA GREEN |
相關代理商/技術參數 |
參數描述 |
|---|---|
| PF38F4040L0YWA | 制造商:Micron Technology Inc 功能描述:256LCR/32PS SCSP 1.8 HF NOKIA - Tape and Reel |
| PF38F4040L0YWAGB | 制造商:Micron Technology Inc 功能描述:WIRELESS - Tape and Reel |
| PF38F4050L0YWQEA | 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays |
| PF38F4050L0ZTQ0 | 制造商:Intel 功能描述:MM#869453 FLASH |
| PF38F4050M0Y0CEA | 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays |
發(fā)布緊急采購，3分鐘左右您將得到回復。