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| 型號： | PCF8578T |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | LCD驅(qū)動器 |
| 英文描述： | LCD row-column driver for dot matrix graphic displays |
| 封裝： | PCF8578HT/1<SOT357-1 (TQFP64)|<<http://www.nxp.com/packages/SOT357-1.html<1<Always Pb-free,;PCF8578T/1<SOT190-1 (VSO56)|<<http://www.nxp.com/packages/SOT190-1.html<1&l |
| 文件頁數(shù)： | 37/46頁 |
| 文件大?。?/td> | 274K |
| 代理商： | PCF8578T |
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PCF8578_6
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 — 5 May 2009
42 of 46
NXP Semiconductors
PCF8578
LCD row/column driver for dot matrix graphic displays
14.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 32) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 19 and 20
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 32.
Table 19.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 20.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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| PCI-36SS-SB-N | STRAIGHT TELECOM AND DATACOM CONNECTOR |
| PCI-36SS-B-H | STRAIGHT TELECOM AND DATACOM CONNECTOR |
| PCI-50R-B-LT | RIGHT ANGLE TELECOM AND DATACOM CONNECTOR |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCF8578T/1 | 制造商:NXP Semiconductors 功能描述:IC LCD DRIVER ROW/COLUMN 56VSOP 制造商:NXP Semiconductors 功能描述:IC, LCD DRIVER, ROW/COLUMN, 56VSOP |
| PCF8578T/1,112 | 功能描述:LCD 驅(qū)動器 LCD DRVR DOT MATRIX RoHS:否 制造商:Maxim Integrated 數(shù)位數(shù)量:4.5 片段數(shù)量:30 最大時鐘頻率:19 KHz 工作電源電壓:3 V to 3.6 V 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:PDIP-40 封裝:Tube |
| PCF8578T/1,118 | 功能描述:LCD 驅(qū)動器 DOT MATRIX LCD DRIVER (R/COLM) RoHS:否 制造商:Maxim Integrated 數(shù)位數(shù)量:4.5 片段數(shù)量:30 最大時鐘頻率:19 KHz 工作電源電壓:3 V to 3.6 V 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:PDIP-40 封裝:Tube |
| PCF8578T/1112 | 制造商:NXP Semiconductors 功能描述:IC LCD DRVR 6V VSOP-56 |
| PCF8578TD | 功能描述:LCD 驅(qū)動器 LCD DRVR DOT MATRIX RoHS:否 制造商:Maxim Integrated 數(shù)位數(shù)量:4.5 片段數(shù)量:30 最大時鐘頻率:19 KHz 工作電源電壓:3 V to 3.6 V 最大工作溫度:+ 85 C 最小工作溫度:- 20 C 封裝 / 箱體:PDIP-40 封裝:Tube |
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