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參數(shù)資料
| 型號： | PCD3755FH |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 8-bit microcontrollers with DTMF generator, 8 kbytes OTP and 128 bytes EEPROM |
| 中文描述： | 8-BIT, OTPROM, 16 MHz, MICROCONTROLLER, PQFP32 |
| 封裝： | 7 X 7 X 1.40 MM, PLASTIC, LQFP-32 |
| 文件頁數(shù)： | 30/32頁 |
| 文件大?。?/td> | 200K |
| 代理商： | PCD3755FH |
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1997 Apr 16
30
Philips Semiconductors
Product specification
8-bit microcontrollers with DTMF generator,
8 kbytes OTP and 128 bytes EEPROM
PCD3755A; PCD3755E;
PCD3755F
22 SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook”(order code 9398 652 90011).
22.1
Reflow soldering
Reflow soldering techniques are suitable for all LQFP and
SO packages. Reflow soldering requires solder paste (a
suspension of fine solder particles, flux and binding agent)
to be applied to the printed-circuit board by screen printing,
stencilling or pressure-syringe dispensing before package
placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
°
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
°
C.
22.2
Wave soldering
22.2.1
LQFP
Wave soldering is
not
recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following
conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The footprint must be at an angle of 45
°
to the board
direction and must incorporate solder thieves
downstream and at the side corners.
Even with these conditions, do not consider wave
soldering LQFP packages LQFP32 (SOT401-1),
LQFP48 (SOT313-2), LQFP64 (SOT314-2 and
SOT414-1), LQFP80 (SOT315-1) or
LQFP100 (SOT407-1).
22.2.2
SO
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
22.2.3
M
ETHOD
(LQFP
AND
SO)
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
°
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
°
C within
6 seconds. Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
22.3
DIP
22.3.1
S
OLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260
°
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
22.4
Repairing soldered joints
Fix LQFP and SO by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
°
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
°
C.
For DIP, apply a low voltage soldering iron (less than 24 V)
to the lead(s) of the package, below the seating plane or
not more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
°
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
°
C, contact may be up to 5 seconds.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCD3755FP | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontrollers with DTMF generator, 8 kbytes OTP and 128 bytes EEPROM |
| PCD3755FT | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:8-bit microcontrollers with DTMF generator, 8 kbytes OTP and 128 bytes EEPROM |
| PCD-40 | 制造商:Power Acoustik 功能描述:AM/FM/CD USB And SD Reader Autosound Head Unit 制造商:POWER ACOUSTIK 功能描述:AUTOSOUND HEAD UNIT AM/FM/CD USB AND SD READER |
| PCD-40-1050B | 制造商:Mean Well 功能描述:PCD-40 series 40 W 1050 mA 38 V AC input 90-135 V Dimmable LED Driver Modules 制造商:Mean Well 功能描述:AC to DC Power Supply Enclosed LED Single Output 22-38 Volts 制造商:Mean Well 功能描述:LED POWER SUPPLY 40W 90 - 135VAC OR 180 - 295VAC IN 350 - 1750MA SLCT CURRENT |
| PCD-40-1400B | 制造商:Mean Well 功能描述:AC to DC Power Supply Enclosed LED Single Output 17-29 Volts 制造商:Mean Well 功能描述:LED POWER SUPPLY 40W 90 - 135VAC OR 180 - 295VAC IN 350 - 1750MA SLCT CURRENT |
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