參數資料
型號： PAC7106
廠商： 飛思卡爾半導體(中國)有限公司
英文描述： Microcontroller Family Hardware Specifications
中文描述： 微控制器系列硬件規(guī)格
文件頁數： 10/56頁
文件大?。?/td> 471K
代理商： PAC7106
MAC7100 Microcontroller Family Hardware Specifications, Rev. 1.2
Preliminary
Electrical Characteristics
Freescale Semiconductor
10
3.6.1
Thermal Resistance Simulation Details
Comments:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board at the center lead. For fused lead packages, the adjacent lead is used.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and junction temperature per JEDEC
JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Table 11. Thermal Resistance for Case Outline 983–02, 100 Lead 14x14 mm LQFP, 0.5 mm Pitch
Rating
Environment
Symbol
R
θ
JA
R
θ
JMA
R
θ
JMA
R
θ
JMA
R
θ
JB
R
θ
JC
Ψ
JT
Value
44
34
37
29
18
7
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Comments
1
,
2
1
,
3
1
,
3
1
,
3
4
5
6
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural Convection
Table 12. Thermal Resistance for Case Outline 987–01, 112 Lead 20x20 mm LQFP, 0.65 mm Pitch
Rating
Environment
Symbol
R
θ
JA
R
θ
JMA
R
θ
JMA
R
θ
JMA
R
θ
JB
R
θ
JC
Ψ
JT
Value
42
34
35
30
22
7
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Comments
1
,
2
1
,
3
1
,
3
1
,
3
4
5
6
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural Convection
Table 13. Thermal Resistance for Case Outline 918–03, 144 Lead 20x20 mm LQFP, 0.5 mm Pitch
Rating
Environment
Symbol
R
θ
JA
R
θ
JMA
R
θ
JMA
R
θ
JMA
R
θ
JB
R
θ
JC
Ψ
JT
Value
42
34
35
30
22
7
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Comments
1
,
2
1
,
3
1
,
3
1
,
3
4
5
6
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural Convection
Table 14. Thermal Resistance for Case Outline 1159A-01, 208 Lead 17x17 mm MAP BGA, 1.0 mm Pitch
Rating
Environment
Symbol
R
θ
JA
R
θ
JMA
R
θ
JMA
R
θ
JMA
R
θ
JB
R
θ
JC
Ψ
JT
Value
46
29
38
26
19
7
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Comments
1
,
2
1
,
3
1
,
3
1
,
3
4
5
6
Junction to Ambient (Natural Convection)
Junction to Ambient (Natural Convection)
Junction to Ambient (@ 200 ft./min.)
Junction to Ambient (@ 200 ft./min.)
Junction to Board
Junction to Case
Junction to Package Top
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural Convection
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