![](http://datasheet.mmic.net.cn/370000/OR2T04A-2PS84_datasheet_16726875/OR2T04A-2PS84_110.png)
Data Sheet
June 1999
ORCA Series 2 FPGAs
110
Lucent Technologies Inc.
AC25
AC24
AC26
AB25
AB23
AB24
AB26
AA25
Y23
AA24
AA26
Y25
Y26
Y24
W25
V23
W26
W24
V25
V26
U25
V24
U26
U23
T25
U24
T26
R25
R26
T24
P25
R23
P26
R24
N25
N23
N26
P24
M25
PR16B
PR16C
PR16D
PR15A
PR15B
PR15C
PR15D
PR14A
PR14B
PR14C
—
PR14D
—
PR13A
PR13B
PR13C
—
PR13D
PR12A
PR12B
—
PR12C
PR12D
PR11A
PR11B
PR11C
PR11D
PR10A
PR10B
PR10C
PR10D
PR9A
PR9B
PR9C
PR9D
PR8A
PR8B
PR8C
PR8D
PR18B
PR18C
PR18D
PR17A
PR17B
PR17C
PR17D
PR16A
PR16B
PR16C
PR16D
PR15A
PR15B
PR15C
PR15D
PR14A
PR14B
PR14C
PR14D
PR13A
PR13B
PR13C
PR13D
PR12A
PR12B
PR12C
PR12D
PR11A
PR11B
PR11C
PR11D
PR10A
PR10B
PR10C
PR10D
PR9A
PR9B
PR9C
PR9D
PR20C
PR20D
PR19A
PR19D
PR18A
PR18B
PR18D
PR17A
PR17B
PR17C
PR17D
PR16A
PR16B
PR16C
PR16D
PR15A
PR15B
PR15C
PR15D
PR14A
PR14B
PR14C
PR14D
PR13A
PR13B
PR13C
PR13D
PR12A
PR12B
PR12C
PR12D
PR11A
PR11B
PR11C
PR11D
PR10A
PR10B
PR10C
PR10D
PR24C
PR24D
PR23A
PR23D
PR22A
PR22B
PR22D
PR21A
PR21B
PR21C
PR21D
PR20A
PR20B
PR20C
PR20D
PR19A
PR19B
PR19C
PR19D
PR18A
PR18B
PR18C
PR18D
PR17A
PR17D
PR16A
PR16D
PR15A
PR15D
PR14A
PR14D
PR13A
PR13B
PR13C
PR13D
PR12A
PR12B
PR12C
PR12D
PR29A
PR29D
PR28A
PR28D
PR27A
PR27B
PR27D
PR26A
PR26B
PR26C
PR25A
PR24A
PR24B
PR24D
PR23D
PR22A
PR22B
PR22C
V
DD
5
PR21A
PR21B
PR21C
PR21D
PR20A
PR20D
PR19A
PR19D
PR18A
PR18D
PR17A
PR17D
PR16A
PR16B
PR16C
PR16D
PR15A
PR15B
PR15C
PR15D
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O-M1
I/O
I/O
I/O
I/O-V
DD
5
I/O
I/O
I/O
I/O
I/O-M2
I/O
I/O
I/O
I/O-M3
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Pin Information
(continued)
Table 27. OR2C/2T10A, OR2C/2T12A, OR2C/2T15A/B, OR2C/2T26A, and OR2T40A/B 352-Pin PBGA
Pinout
(continued)
Pin
2C/2T10A Pad
2C/2T12A Pad
2C/2T15A/B Pad
2C/2T26A Pad OR2T40A/B Pad
Function
Notes:
The pins labeled I/O-V
DD
5 are user I/Os for the OR2CxxA and OR2TxxB series, but they are connected to V
DD
5 for the OR2TxxA series.
The pins labeled V
SS
-ETC are the 6 x 6 array of thermal balls located at the center of the package. The balls can be attached to the ground plane
of the board for enhanced thermal capability (see Table 29), or they can be left unconnected.