OPA622
15
when a signal is applied. For high-speed op amps, a more
precise approach to determine power consumption is to
measure the average total quiescent current for several
typical load conditions. The power consumption of the
OPA622 is influenced by the signal type and frequency, the
output voltage and load resistor, and the repetition rate of the
signal transitions. Figure 14 shows the total average supply
current versus the frequency of an applied sine wave for
various output voltages. Figure 15 illustrates the total
quiescent current versus the repetition frequency of an
applied square wave signal.
CIRCUIT LAYOUT
The high-frequency performance of the OPA622 can be
greatly affected by the physical layout of the printed circuit
board. The following tips are offered as suggestions, not as
absolute musts. Oscillations, ringing, poor bandwidth and
settling, and peaking are all typical problems that plague
high-speed components when they are used incorrectly.
Bypass power supplies very close to the device pins. Use
tantalum chip capacitors (approximately 2.2
μ
F) and a
parallel 470pF ceramic chip capacitor. Surface-mount types
are recommended because of their low lead inductance.
PC board traces for power lines should be wide to reduce
impedance.
Make short, low-inductance traces. The entire physical
circuit should be as small as possible.
Use a low-impedance ground plane on the component side
to ensure that low-impedance ground is available through-
out the layout.
Place the R
OG
resistor as close as possible to the package
and use the shortest possible trace length.
Do not extend the ground plane over high-impedance
nodes sensitive to stray capacitances such as the amplifier’s
input and R
OG
terminals.
Sockets are not recommended, because they add signifi-
cant inductance and parasitic capacitance. If sockets are
required, use zero-profile solderless sockets.
Use low-inductance, surface-mount components for
best AC performance.
A resistor (50
to 330
) in series with the high-imped-
ance inputs is strictly recommended for stable operation.
Plug-in prototype boards and wire-wrap boards will not
function well. A clean layout using RF techniques is
essential.
FIGURE 11. Optimum Response vs Closed-Loop Gains.
FIGURE 12. Closed-Loop Gain vs R
OG
.
10
5
0
–5
–10
–15
–20
–25
A
Frequency (Hz)
100k
1M
10M
100M
1G
R
OG
= 50
R
OG
= 150
R
OG
= 300
G
CL
= +2V/V
15
10
5
0
–5
–10
–15
–20
–25
–30
1M
10M
1M
1G
Frequency (Hz)
G
20
R
OG
= 10
R
OG
= 150
R
OG
= 390
R
OG
= 200
R
OG
= 120
100k
G
CL
= +10
G
CL
= +2
G
CL
= +1
G
CL
= –1
G
CL
= –2
OPA622AP
V
= 1.4Vp-p, Refer to Table I for
recommended component values.
FIGURE 14. Average Supply Current vs Frequency (Sine Wave).
FIGURE 13. Bandwidth vs C
LOAD
.
1M
10M
100M
1G
Frequency (Hz)
G
G
CL
= +2V/V, V
O
= 2.8Vp-p
10pF
22pF
47pF
C
LOAD
R
OG
C
OTA
10p180
0.5p
22p200
0.5p
47p150
0.5p
50
40
30
20
10
0
Frequency (Hz)
A
300k
1M
10M
100M
1G
G = +2V/V, R
LOAD
= 100
5Vp-p
2.8Vp-p
1.4Vp-p
0.2Vp-p