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參數(shù)資料
| 型號： | MWIC930R1 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 放大器 |
| 英文描述： | RF LDMOS Wideband Integrated Power Amplifiers |
| 中文描述： | 746 MHz - 960 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER |
| 封裝： | PLASTIC, CASE 1329-08, TO-272, 16 PIN |
| 文件頁數(shù)： | 1/12頁 |
| 文件大?。?/td> | 394K |
| 代理商： | MWIC930R1 |
1
MWIC930R1 MWIC930GR1
MOTOROLA RF DEVICE DATA
The RF Line
RF LDMOS Integrated
Power Amplifiers
The MWIC930 wideband integrated circuit is designed for CDMA and
GSM/GSM EDGE applications. It uses Motorola’s newest High Voltage (26 to
28 Volts) LDMOS IC technology and integrates a multi-stage structure. Its
wideband On Chip integral matching circuitry makes it usable from 746 to 960
MHz. The linearity performances cover all modulations for cellular applications:
GSM, GSM EDGE, TDMA, N-CDMA and W-CDMA.
Typical CDMA Performance: 27 Volts, IDQ1 = 90 mA,
IDQ2 = 240 mA, 2-Carrier N-CDMA, IS -95, 869-894 MHz, 1.2288 MHz
Channel Bandwidth, IM3 Measured in 1.2288 Integrated Bandwidth, ACPR
Measured in 30 kHz Integrated Bandwidth, 2.5 MHz Carrier Spacing
Output Power — 5 Watts (Avg.)
Power Gain — 31 dB
Efficiency — 21%
Adjacent Channel Power — -52 dBc
IRL — -14 dB
Typical Performance @ P1dB: 921-960 MHz, 26 Volts
Output Power — 30 Watts P1dB
Power Gain — 30 dB
Efficiency — 45%
On Chip Matching (50 Ohm Input, >4 Ohm Output)
Integrated Temperature Compensation Capability
Integrated ESD Protection
Usable for SCPA and MCPA Architecture
Capable of Handling 5:1 VSWR, @ 26 Vdc, f = 921 MHz,
Pout = 30 W CW, IDQ1 = 90 mA, IDQ2 = 240 mA
Can Be Bolted or Soldered through a Hole in the Circuit Board for
Maximum Thermal Performance
Also Available in Gull Wing for Surface Mount
Available in Tape and Reel. R1 Suffix = 500 Units per 44 mm, 13 inch Reel.
Order this document
by MWIC930/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
N-CDMA, W-CDMA,
GSM/GSM EDGE, 746 - 960 MHz,
30 W, 26-28 V RF LDMOS
INTEGRATED POWER AMPLIFIERS
CASE 1329-09
TO-272 WB-16
PLASTIC
MWIC930R1
MWIC930R1
MWIC930GR1
CASE 1329A-03
TO-272 WB-16 GULL
PLASTIC
MWIC930GR1
Motorola, Inc. 2003
Functional Block Diagram
PIN CONNECTIONS
(Top View)
GND
VDS1
RFin
VGS1
GND
RFout /
VDS2
GND
VGS2
GND
Temperature Compensation
VDS1
RFin
VGS1
RFout/VDS2
VGS2
NC
2
3
4
5
6
7
8
16
15
14
13
12
9
10
11
1
REV 1
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