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4Mb: 256K x 18, 128K x 32/36 Pipelined ZBT SRAM
MT55L256L18P1_2.p65
–
Rev. 8/00
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2000, Micron Technology, Inc.
PRELIMINARY
4Mb: 256K x 18, 128K x 32/36
PIPELINED ZBT SRAM
165-PIN FBGA
NOTE:
1. All dimensions in millimetersMAXor typical where noted.
MIN
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
10.00
14.00
15.00 ±0.10
1.00
(TYP)
1.00
(TYP)
5.00 ±0.05
13.00 ±0.10
PIN A1 ID
PIN A1 ID
BALL A1
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb
SOLDER BALL PAD:
.33mm
6.50 ±0.05
7.00 ±0.05
7.50 ±0.05
1.20 MAX
SEATING PLANE
0.85 ±0.075
0.10
A
A
165X
0.45
BALL A11
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micronsemi.com, Customer Comment Line: 800-932-4992
Micron is a registered trademark of Micron Technology, Inc.
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc., and the architecture is supported by
Micron Technology, Inc., and Motorola, Inc.