參數(shù)資料
型號: MT54W4MH8BF-5
廠商: Micron Technology, Inc.
英文描述: 36Mb QDR⑩II SRAM 2-WORD BURST
中文描述: ⑩分配36MB四年防務(wù)審查II SRAM的2字爆
文件頁數(shù): 26/27頁
文件大?。?/td> 302K
代理商: MT54W4MH8BF-5
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron and the M logo are registered trademarks and SyncBurst and the Micron logo are trademarks of Micron Technology, Inc.
QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress Semiconductor, IDT, Micron Technology,
Inc., NEC, and Samsung.
4 MEG x 8, 4 MEG x 9, 2 MEG x 18, 1 MEG x 36
1.8V V
DD
, HSTL, QDRIIb2 SRAM
ADVANCE
36Mb: 1.8V V
DD
, HSTL, QDRIIb2 SRAM
MT54W2MH18B_A.fm - Rev 9/02
2002, Micron Technology Inc.
26
Figure 11
165-Ball FBGA
NOTE:
1. All dimensions are in millimeters.
DATA SHEET DESIGNATION
Advance:
This data sheet contains initial descriptions of products still under development.
0.850 ±0.075
7.00 ±0.05
15.00 ±0.10
8.50 ±0.10
17.00 ±0.10
7.50 ±0.05
5.00 ±0.05
10.00
BALL A11
BALL A1
PIN A1 ID
1.00
TYP
1.00
TYP
14.00
SEATING PLANE
C
0.12 C
PIN A1 ID
1.20 MAX
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: .33mm
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS 0.40
165X
0.45
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