參數(shù)資料
型號(hào)： MSP430F5517IPNR
廠商： TEXAS INSTRUMENTS INC
元件分類： 微控制器/微處理器
英文描述： 16-BIT, FLASH, RISC MICROCONTROLLER, PQFP80
封裝： GREEN, PLASTIC, LQFP-80
文件頁數(shù)： 62/119頁
文件大?。?/td> 1351K
代理商： MSP430F5517IPNR
MSP430F551x
MSP430F552x
SLAS590E
– MARCH 2009 – REVISED APRIL 2011
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
Voltage applied at VCC to VSS
–0.3 V to 4.1 V
Voltage applied to any pin (excluding VCORE, VBUS, V18)(2)
–0.3 V to VCC + 0.3 V
Diode current at any device pin
±2 mA
Storage temperature range, Tstg
(3)
–55°C to 150°C
Maximum operating junction temperature, TJ
95
°C
(1)
Stresses beyond those listed under
"absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
"recommended operating
conditions
" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages referenced to VSS. VCORE is for internal device usage only. No external DC loading or voltage should be applied.
(3)
Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
Thermal Packaging Characteristics
PARAMETER
VALUE
UNIT
LQFP (PN)
70
VQFN (RGC)
55
Low-K board (JESD51-3)
DSBGA (YFF)
TBD
BGA (ZQE)
84
θJA
Junction-to-ambient thermal resistance, still air
°C/W
LQFP (PN)
45
VQFN (RGC)
25
High-K board (JESD51-7)
DSBGA (YFF)
TBD
BGA (ZQE)
46
LQFP (PN)
12
VQFN (RGC)
12
θJC
Junction-to-case thermal resistance
°C/W
DSBGA (YFF)
TBD
BGA (ZQE)
30
LQFP (PN)
22
VQFN (RGC)
6
θJB
Junction-to-board thermal resistance
°C/W
DSBGA (YFF)
TBD
BGA (ZQE)
20
Copyright
2009–2011, Texas Instruments Incorporated
47
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MSP430F5519IPN 功能描述:16位微控制器 - MCU Mixed Signal Micro controller RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MSP430F5519IPNR 功能描述:16位微控制器 - MCU Mixed Signal Micro controller RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MSP430F5521IPN 功能描述:16位微控制器 - MCU Mixed Signal Micro controller RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MSP430F5521IPNR 功能描述:16位微控制器 - MCU Mixed Signal Micro controller RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MSP430F5522IRGCR 功能描述:16位微控制器 - MCU Mixed Signal Micro controller RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲(chǔ)器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
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