參數(shù)資料
型號(hào): MSP430F2274MRHAEP
廠商: TEXAS INSTRUMENTS INC
元件分類: 微控制器/微處理器
英文描述: 16-BIT, FLASH, RISC MICROCONTROLLER, PQCC40
封裝: GREEN, PLASTIC, MO-220VJJD-2, VQFN-40
文件頁數(shù): 28/79頁
文件大?。?/td> 1274K
代理商: MSP430F2274MRHAEP
SLAS614C – SEPTEMBER 2008 – REVISED JULY 2010
www.ti.com
Crystal Oscillator (LFXT1) High Frequency Modes – Electrical Characteristics
(1) (2)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
VCC
MIN
TYP
MAX UNIT
fLFXT1,H
LFXT1 oscillator crystal frequency,
XTS = 1, LFXT1Sx = 0
–55°C to 125°C
1.8 V to 3.6 V
0.4
1
MHz
F0
HF mode 0
fLFXT1,H
LFXT1 oscillator lcrystal frequency,
XTS = 1, LFXT1Sx = 1
–55°C to 125°C
1.8 V to 3.6 V
1
4
MHz
F1
HF mode 1
1.8 V to 3.6 V
2
10
fLFXT1,H
LFXT1 oscillator crystal frequency,
XTS = 1, LFXT1Sx = 2
–55°C to 125°C
2.2 V to 3.6 V
2
12
MHz
F2
HF mode 2
3 V to 3.6 V
2
16
1.8 V to 3.6 V
0.4
10
LFXT1 oscillator logic-level
fLFXT1,H
square-wave input frequency,
XTS = 1, LFXT1Sx = 3
–55°C to 125°C
2.2 V to 3.6 V
0.4
12
MHz
F,logic
HF mode
3 V to 3.6 V
0.4
16
XTS = 0, LFXT1Sx = 0;
fLFXT1,HF = 1 MHz,
2700
CL,eff = 15 pF
Oscillation allowance for HF
XTS = 0, LFXT1Sx = 1
OAHF
crystals
fLFXT1,HF = 4 MHz,
–55°C to 125°C
800
CL,eff = 15 pF
XTS = 0, LFXT1Sx = 2
fLFXT1,HF = 16 MHz,
300
CL,eff = 15 pF
Integrated effective load
CL,eff
capacitance,
XTS = 1(4)
–55°C to 125°C
1
pF
HF mode(3)
XTS = 1, Measured at
P1.4/ACLK,
–55°C to 125°C
40
50
60
fLFXT1,HF = 10 MHz
Duty
HF mode
2.2 V/3 V
%
Cycle
XTS = 1, Measured at
P1.4/ACLK,
–55°C to 125°C
40
50
60
fLFXT1,HF = 16 MHz
Oscillator fault frequency, HF mode
fFault,HF
XTS = 1, LFXT1Sx = 3(6)
–55°C to 125°C
2.2 V/3 V
30
300
kHz
(5)
(1)
To improve EMI on the LFXT1 oscillator the following guidelines should be observed:
(a) Keep as short of a trace as possible between the device and the crystal.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This
signal is no longer required for the serial programming adapter.
(2)
Use of the LFXT1 Crystal Oscillator with TA > 105°C is not guaranteed. It is recommended that an external digital clock source or the
internal DCO is used to provide clocking.
(3)
Includes parasitic bond and package capacitance (approximately 2 pF per pin). Since the PCB adds additional capacitance it is
recommended to verify the correct load by measuring the ACLK frequency. For a correct setup the effective load capacitance should
always match the specification of the used crystal.
(4)
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(5)
Frequencies below the MIN specification set the fault flag, frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
(6)
Measured with logic-level input frequency, but also applies to operation with crystals
34
Copyright 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): MSP430F2274-EP
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