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| 型號： | MSC8113TVT4800V |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 6/44頁 |
| 文件大?。?/td> | 0K |
| 描述： | DSP TRI-CORE 431-FCPBGA |
| 標(biāo)準(zhǔn)包裝： | 60 |
| 系列： | StarCore |
| 類型： | SC140 內(nèi)核 |
| 接口： | 以太網(wǎng)，I²C，TDM，UART |
| 時鐘速率： | 400MHz |
| 非易失內(nèi)存： | 外部 |
| 芯片上RAM： | 1.436MB |
| 電壓 - 輸入/輸出： | 3.30V |
| 電壓 - 核心： | 1.10V |
| 工作溫度： | -40°C ~ 105°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 431-BFBGA，F(xiàn)CBGA |
| 供應(yīng)商設(shè)備封裝： | 431-FCPBGA（20x20） |
| 包裝： | 托盤 |
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MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1
Electrical Characteristics
Freescale Semiconductor
14
2.2
Recommended Operating Conditions
Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed.
Table 4 describes thermal characteristics of the MSC8113 for the FC-PBGA packages.
Section 3.5, Thermal Considerations provides a detailed explanation of these characteristics.
This section describes the DC electrical characteristics for the MSC8113. The measurements in Table 5 assume the following
system conditions:
TA = 25 °C
VDD = 1.1 V nominal = 1.07–1.13 VDC
VDDH = 3.3 V ± 5% VDC
GND
= 0 VDC
Note:
The leakage current is measured for nominal VDDH and VDD.
Table 3. Recommended Operating Conditions
Rating
Symbol
Value
Unit
Core and PLL supply voltage:
VDD
VCCSYN
1.07 to 1.13
V
I/O supply voltage
VDDH
3.135 to 3.465
V
Input voltage
VIN
–0.2 to VDDH+0.2
V
Operating temperature range:
TJ
–40 to 105
°C
Table 4. Thermal Characteristics for the MSC8113
Characteristic
Symbol
FC-PBGA
20
× 20 mm5
Unit
Natural
Convection
200 ft/min
(1 m/s) airflow
Junction-to-ambient1, 2
RθJA
26
21
°C/W
Junction-to-ambient, four-layer board1, 3
RθJA
19
15
°C/W
Junction-to-board (bottom)4
RθJB
9
°C/W
Junction-to-case5
RθJC
0.9
°C/W
Junction-to-package-top6
ΨJT
1
°C/W
Notes:
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3.
Per JEDEC JESD51-6 with the board horizontal.
4.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
5.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6.
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MSC8113TVT4800V | 制造商:Freescale Semiconductor 功能描述:Tri-Core Digital Signal Processor |
| MSC8113-V1 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Tri-Core Digital Signal |
| MSC8120 | 制造商:FOSSE 功能描述:MAINTENANCE ABSORB SOCK |
| MSC8122 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Quad Digital Signal Processor |
| MSC8122_07 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Quad Digital Signal Processor |
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