參數(shù)資料
型號(hào)： MSC8113TVT4800V
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 37/44頁(yè)
文件大?。?/td> 0K
描述： DSP TRI-CORE 431-FCPBGA
標(biāo)準(zhǔn)包裝： 60
系列： StarCore
類型： SC140 內(nèi)核
接口： 以太網(wǎng)，I²C，TDM，UART
時(shí)鐘速率： 400MHz
非易失內(nèi)存： 外部
芯片上RAM： 1.436MB
電壓 - 輸入/輸出： 3.30V
電壓 - 核心： 1.10V
工作溫度： -40°C ~ 105°C
安裝類型： 表面貼裝
封裝/外殼： 431-BFBGA，F(xiàn)CBGA
供應(yīng)商設(shè)備封裝： 431-FCPBGA（20x20）
包裝： 托盤
MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1
Package Information
Freescale Semiconductor
42
5
Package Information
6
Product Documentation
MSC8113 Technical Data Sheet (MSC8113). Details the signals, AC/DC characteristics, clock signal characteristics,
package and pinout, and electrical design considerations of the MSC8113 device.
MSC8113 Reference Manual (MSC8113RM). Includes functional descriptions of the extended cores and all the
internal subsystems including configuration and programming information.
Application Notes. Cover various programming topics related to the StarCore DSP core and the MSC8113 device.
SC140 DSP Core Reference Manual. Covers the SC140 core architecture, control registers, clock registers, program
control, and instruction set.
Figure 35. MSC8113 Mechanical Information, 431-pin FC-PBGA Package
Notes:
1. All dimensions in millimeters.
2. Dimensioning and tolerancing
per ASME Y14.5M–1994.
3. Features are symmetrical about
the package center lines unless
dimensioned otherwise.
4. Maximum solder ball diameter
measured parallel to Datum A.
5. Datum A, the seating plane, is
determined by the spherical
crowns of the solder balls.
6. Parallelism measurement shall
exclude any effect of mark on
top surface of package.
7. Capacitors may not be present
on all devices.
8. Caution must be taken not to
short capacitors or exposed
metal capacitor pads on
package top.
9. FC CBGA (Ceramic) package
code: 5238.
FC PBGA (Plastic) package
code: 5263.
10.Pin 1 indicator can be in the
form of number 1 marking or an
“L” shape marking.
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