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參數(shù)資料
| 型號： | MR18R162GEG0-CT9 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | Key Timing Parameters |
| 中文描述： | 關(guān)鍵的定時參數(shù) |
| 文件頁數(shù)： | 7/16頁 |
| 文件大小： | 442K |
| 代理商： | MR18R162GEG0-CT9 |
Page 6
MR16R1624(8/G)EG0
MR18R1624(8/G)EG0
Version 1.0 May 2004
Absolute Maximum Ratings
DC Recommended Electrical Conditions
Table 4: Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
V
I,ABS
Voltage applied to any RSL or CMOS signal pad with respect to Gnd
- 0.3
V
DD
+ 0.3
V
V
DD,ABS
Voltage on VDD with respect to Gnd
- 0.5
V
DD
+ 1.0
V
T
STORE
Storage temperature
- 50
100
°
C
T
PLATE
Plate temperature
-
92
°
C
Table 5: DC Recommended Electrical Conditions
Symbol
Parameter and Conditions
Min
Max
Unit
V
DD
Supply voltage
2.50 - 0.13
2.50 + 0.13
V
V
CMOS
CMOS I/O power supply at pad for 2.5V controllers:
CMOS I/O power supply at pad for 1.8V controllers:
V
DD
1.8 - 0.1
V
DD
1.8 + 0.2
V
V
V
REF
Reference voltage
1.4 - 0.2
1.4 + 0.2
V
V
SPD
Serial Presence Detector- Positive power supply
2.2
3.6
V
Table 6: RIMM Module Capacity and Number of RDRAM device
RIMM Module Capacity:
512/576MB
256/288MB
128/144MB
Number of 256/288Mb RDRAM devices
16
8
4
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