- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄1955 > MPC8349ECZUAJFB (Freescale Semiconductor)IC MPU POWERQUICC II PRO 672TBGA PDF資料下載
參數(shù)資料
| 型號： | MPC8349ECZUAJFB |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 73/87頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU POWERQUICC II PRO 672TBGA |
| 標(biāo)準(zhǔn)包裝： | 24 |
| 系列： | MPC83xx |
| 處理器類型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 533MHz |
| 電壓： | 1.2V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 672-LBGA |
| 供應(yīng)商設(shè)備封裝： | 672-TBGA（35x35） |
| 包裝： | 托盤 |
| 配用： | MPC8349E-MITX-GP-ND - KIT REFERENCE PLATFORM MPC8349E MPC8349E-MITXE-ND - BOARD REFERENCE FOR MPC8349 MPC8349EA-MDS-PB-ND - KIT MODULAR DEV SYSTEM MPC8349E |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁當(dāng)前第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁
MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
Freescale Semiconductor
75
Thermal
20.2
Thermal Management Information
For the following sections, PD = (VDD × IDD) + PI/O where PI/O is the power dissipation of the I/O drivers.
See Table 5 for I/O power dissipation values.
20.2.1
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TJ = junction temperature (°C)
TA = ambient temperature for the package (°C)
RθJA = junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy
estimation of thermal performance. Generally, the value obtained on a single-layer board is appropriate for
a tightly packed printed-circuit board. The value obtained on the board with the internal planes is usually
appropriate if the board has low power dissipation and the components are well separated. Test cases have
demonstrated that errors of a factor of two (in the quantity TJ –TA) are possible.
20.2.2
Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal
resistance. The thermal performance of any component is strongly dependent on the power dissipation of
surrounding components. In addition, the ambient temperature varies widely within the application. For
many natural convection and especially closed box applications, the board temperature at the perimeter
Junction-to-package natural convection on top
ψ
JT
1
°C/W
6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal, 1 m/s is approximately equal to 200 linear feet per minute (LFM).
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Table 63. Package Thermal Characteristics for TBGA (continued)
Characteristic
Symbol
Value
Unit
Notes
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC8358ECZUADDE | IC MPU PWRQUICC II 740-TBGA |
| MPC8358EVVAGDG | IC MPU POWERQUICC II 740-TBGA |
| MPC8360EVVAJDGA | IC MPU POWERQUICC II PRO 740TBGA |
| MPC8377CVRANGA | MPU POWERQUICC II 800MHZ 689PBGA |
| MPC8377EVRANG | MPU POWERQUICC II PRO 689-PBGA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8349ECZUALDB | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MPC8349ECZUALFB | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MPC8349E-MDS | 功能描述:開發(fā)板和工具包 - 其他處理器 KIT FOR MPC8349E BDS RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| MPC8349E-MDS-PB | 功能描述:開發(fā)板和工具包 - 其他處理器 PROCESSR BD MPC8349E RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| MPC8349E-MDS-PBE | 功能描述:開發(fā)板和工具包 - 其他處理器 MPC8349E FAMILY ADS RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。