參數(shù)資料
型號: MPC8241LZQ266D
廠商: Freescale Semiconductor
文件頁數(shù): 46/58頁
文件大?。?/td> 0K
描述: IC MPU 32BIT 266MHZ 357-PBGA
標(biāo)準(zhǔn)包裝: 44
系列: MPC82xx
處理器類型: 32-位 MPC82xx PowerQUICC II
速度: 266MHz
電壓: 1.8V
安裝類型: 表面貼裝
封裝/外殼: 357-BBGA
供應(yīng)商設(shè)備封裝: 357-PBGA(25x25)
包裝: 托盤
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
50
Freescale Semiconductor
System Design Information
Figure 31. Thermal Performance of Select Thermal Interface Material
The board designer can choose among several types of thermal interface. Heat sink adhesive materials are
selected on the basis of high conductivity and adequate mechanical strength to meet equipment
shock/vibration requirements. Several commercially-available thermal interfaces and adhesive materials
are provided by the following vendors:
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
0
0.5
1
1.5
2
0
1020304050607080
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Sp
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/W
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