參數(shù)資料
型號(hào)： MPC8241LZQ266D
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 44/58頁(yè)
文件大小： 0K
描述： IC MPU 32BIT 266MHZ 357-PBGA
標(biāo)準(zhǔn)包裝： 44
系列： MPC82xx
處理器類型： 32-位 MPC82xx PowerQUICC II
速度： 266MHz
電壓： 1.8V
安裝類型： 表面貼裝
封裝/外殼： 357-BBGA
供應(yīng)商設(shè)備封裝： 357-PBGA（25x25）
包裝： 托盤(pán)
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
49
System Design Information
7.7.1
Internal Package Conduction Resistance
For the PBGA, die-up, packaging technology, shown in Figure 28, the intrinsic conduction thermal
resistance paths are as follows:
The die junction-to-case thermal resistance
The die junction-to-ball thermal resistance
Figure 30 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 30. PBGA Package with Heat Sink Mounted to a Printed-Circuit Board
For this die-up, wire-bond PBGA package, heat generated on the active side of the chip is conducted
mainly through the mold cap, the heat sink attach material (or thermal interface material), and finally
through the heat sink where forced-air convection removes it.
7.7.2
Adhesives and Thermal Interface Materials
A thermal interface material should be used between the top of the mold cap and the bottom of the heat
sink minimizes thermal contact resistance. For applications that attach the heat sink by a spring clip
mechanism, Figure 31 shows the thermal performance of three thin-sheet thermal-interface materials
(silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing contact
pressure. Thermal grease significantly reduces the interface thermal resistance. That is, the bare joint offers
a thermal resistance approximately seven times greater than the thermal grease joint.
A spring clip attaches heat sinks to holes in the printed-circuit board (see Figure 28). Therefore, the
synthetic grease offers the best thermal performance, considering the low interface pressure. The selection
of any thermal interface material depends on factors such as thermal performance requirements,
manufacturability, service temperature, dielectric properties, and cost.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance)
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