參數資料
型號： MPC8241LVR266D
廠商： Freescale Semiconductor
文件頁數： 44/58頁
文件大?。?/td> 0K
描述： IC MPU 32BIT 266MHZ PPC 357-PBGA
標準包裝： 44
系列： MPC82xx
處理器類型： 32-位 MPC82xx PowerQUICC II
速度： 266MHz
電壓： 1.8V
安裝類型： 表面貼裝
封裝/外殼： 357-BBGA
供應商設備封裝： 357-PBGA（25x25）
包裝： 托盤
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
49
System Design Information
7.7.1
Internal Package Conduction Resistance
For the PBGA, die-up, packaging technology, shown in Figure 28, the intrinsic conduction thermal
resistance paths are as follows:
The die junction-to-case thermal resistance
The die junction-to-ball thermal resistance
Figure 30 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 30. PBGA Package with Heat Sink Mounted to a Printed-Circuit Board
For this die-up, wire-bond PBGA package, heat generated on the active side of the chip is conducted
mainly through the mold cap, the heat sink attach material (or thermal interface material), and finally
through the heat sink where forced-air convection removes it.
7.7.2
Adhesives and Thermal Interface Materials
A thermal interface material should be used between the top of the mold cap and the bottom of the heat
sink minimizes thermal contact resistance. For applications that attach the heat sink by a spring clip
mechanism, Figure 31 shows the thermal performance of three thin-sheet thermal-interface materials
(silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing contact
pressure. Thermal grease significantly reduces the interface thermal resistance. That is, the bare joint offers
a thermal resistance approximately seven times greater than the thermal grease joint.
A spring clip attaches heat sinks to holes in the printed-circuit board (see Figure 28). Therefore, the
synthetic grease offers the best thermal performance, considering the low interface pressure. The selection
of any thermal interface material depends on factors such as thermal performance requirements,
manufacturability, service temperature, dielectric properties, and cost.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance)
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參數描述
MPC8241LZQ166D 功能描述:微處理器 - MPU 166MHz 315.4MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241LZQ200D 功能描述:微處理器 - MPU 200MHz 380MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241LZQ200D 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 200MHZ BGA-357
MPC8241LZQ266D 功能描述:微處理器 - MPU 266MHz 266MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8241TVR166D 功能描述:微處理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數據總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數據 RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
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