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參數(shù)資料
| 型號： | MPC603E7TEC |
| 廠商： | Motorola, Inc. |
| 英文描述： | PowerPC 603e RISC Microprocessor |
| 中文描述： | RISC微處理器的PowerPC 603e |
| 文件頁數(shù)： | 30/36頁 |
| 文件大小： | 551K |
| 代理商： | MPC603E7TEC |
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PID7t-603e Hardware Specifications
System Design Information
Figure 17. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Dow-Corning Corporation
Dow-Corning Electronic Materials
PO Box 0997
Midland, MI 48686-0997
Internet: www.dow.com
800-248-2481
Chomerics, Inc.
77 Dragon Court
Woburn, MA 01888-4014
Internet: www.chomerics.com
781-935-4850
Thermagon Inc.
3256 West 25th Street
Cleveland, OH 44109-1668
Internet: www.thermagon.com
888-246-9050
0
0.5
1
1.5
2
0
10
20
30
40
50
60
70
80
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
Contact Pressure (psi)
S
2
/
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
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相關代理商/技術參數(shù) |
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|---|---|
| MPC603E7TED | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PowerPC 603e RISC Microprocessor |
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| MPC603EFE133TN | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
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