參數(shù)資料
型號： MPC5646CF0CMJ8
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 80 MHz, MICROCONTROLLER, PBGA256
封裝： 17 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MAPBGA-256
文件頁數(shù)： 55/115頁
文件大?。?/td> 783K
代理商： MPC5646CF0CMJ8
MPC5646C Microcontroller Datasheet, Rev. 4
Preliminary—Subject to Change Without Notice
Electrical Characteristics
Freescale Semiconductor
44
4.5
Thermal characteristics
4.5.1
Package thermal characteristics
4.5.2
Power considerations
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using Equation 1:
TJ = TA + (PD RJA)
Eqn. 1
Where:
TA is the ambient temperature in °C.
RJA is the package junction-to-ambient thermal resistance, in °C/W.
PD is the sum of PINT and PI/O (PD =PINT + PI/O).
PINT is the product of IDD and VDD, expressed in watts. This is the chip internal power.
PI/O represents the power dissipation on input and output pins; user determined.
Table 11. LQFP thermal characteristics1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Symbol
C
Parameter
Conditions2
2 V
DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C.
Pin count
Value3
3 All values need to be confirmed during device validation.
Unit
Typ
Max
RJA
CC
D
Thermal resistance,
junction-to-ambient
natural convection4
4 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Single-layer
board—1s
176
—
385
5 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6.
°C/W
208
—
416
6 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-2 and JESD51-6
°C/W
RJA
CC
D
Thermal resistance,
junction-to-ambient
natural convection7
Four-layer
board—2s2p7
7 Junction-to-Board thermal resistance determined per JEDEC JESD51-8.
176
—
31
°C/W
208
—
34
°C/W
Table 12. 256 MAPBGA thermal characteristics1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Symbol
C
Parameter
Conditions
Value
Unit
RJA CC — Thermal resistance, junction-to-ambient
natural convection
Single-layer board—1s
432
2 Junction-to-ambient thermal resistance determined per JEDEC JESD51-2 with the single layer board horizontal.
Board meets JESD51-9 specification.
°C/W
Four-layer board—2s2p
263
3 Junction-to-ambient thermal resistance determined per JEDEC JESD51-6 with the board horizontal.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC564AADPT176 功能描述:開發(fā)板和工具包 - 其他處理器 ANDORRA ADAPT RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC564AADPT208 制造商:Freescale Semiconductor 功能描述:ANDORRA ADAPSOLDERED
MPC564AKIT176 功能描述:開發(fā)板和工具包 - 其他處理器 ANDORRA 176QFP KIT RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC564AKIT176S 制造商:Freescale Semiconductor 功能描述:MPC564XA 176 LQFP SOCKET EVAL KIT 制造商:Freescale Semiconductor 功能描述:MPC564XA, 176 LQFP SOCKET, EVAL KIT
MPC564AKIT208 制造商:Freescale Semiconductor 功能描述:ANDORRA 208BGA KIT
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