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參數(shù)資料
| 型號： | MPC5607BVLL4R |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | FLASH, 48 MHz, MICROCONTROLLER, PQFP100 |
| 封裝： | 14 X 14 MM, 1.40 MM HEIGHT, MS-026 BED, LQFP-100 |
| 文件頁數(shù)： | 62/106頁 |
| 文件大?。?/td> | 667K |
| 代理商： | MPC5607BVLL4R |
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Electrical characteristics
MPC5607B Microcontroller Data Sheet, Rev. 5
Freescale Semiconductor
59
4.10.3
Start-up/Switch-off timings
4.11
Electromagnetic compatibility (EMC) characteristics
Susceptibility tests are performed on a sample basis during product characterization.
4.11.1
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical application environment and simplified
MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in
particular.
Therefore it is recommended that the user apply EMC software optimization and prequalification tests in relation with the EMC
level requested for the application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
— Corrupted program counter
— Unexpected reset
— Critical data corruption (control registers...)
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the reset pin or the oscillator pins for 1 second.
To complete these trials, ESD stress can be applied directly on the device. When unexpected behavior is detected, the
software can be hardened to prevent unrecoverable errors occurring.
4.11.2
Electromagnetic interference (EMI)
The product is monitored in terms of emission based on a typical application. This emission test conforms to the IEC61967-1
standard, which specifies the general conditions for EMI measurements.
Table 29. Start-up time/Switch-off time
Symbol
C
Parameter
Conditions1
1 V
DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified
Value
Unit
Min
Typ
Max
TFLARSTEXIT
CC T Delay for Flash module to exit reset mode
—
125
s
TFLALPEXIT
CC T Delay for Flash module to exit low-power mode
—
0.5
TFLAPDEXIT
CC T Delay for Flash module to exit power-down
mode
——
—
30
TFLALPENTRY
CC T Delay for Flash module to enter low-power
mode
——
—
0.5
TFLAPDENTRY
CC T Delay for Flash module to enter power-down
mode
——
—
1.5
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