參數(shù)資料
型號(hào)： MPC5554EVB
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 57/58頁(yè)
文件大小： 0K
描述： BOARD EVALUATION MPC5554
標(biāo)準(zhǔn)包裝： 1
類(lèi)型： 微控制器
適用于相關(guān)產(chǎn)品： MPC5554
所含物品： 評(píng)估板和演示軟件
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MPC5554 Microcontroller Data Sheet, Rev. 4
Electrical Characteristics
Freescale Semiconductor
8
The thermal characterization parameter is measured in compliance with the JESD51-2 specification using
a 40-gauge type T thermocouple epoxied to the top center of the package case. Position the thermocouple
so that the thermocouple junction rests on the package. Place a small amount of epoxy on the thermocouple
junction and approximately 1 mm of wire extending from the junction. Place the thermocouple wire flat
against the package case to avoid measurement errors caused by the cooling effects of the thermocouple
wire.
References:
Semiconductor Equipment and Materials International
3081 Zanker Rd.
San Jose, CA., 95134
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specifications are available on the web at http://www.jedec.org.
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive
Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applica-
tions,” Electronic Packaging and Production, pp. 53–58, March 1998.
3. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and
Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212–220.
3.3
Package
The MPC5554 is available in packaged form. Read the package options in Section 2, “Ordering
Information.” Refer to Section 4, “Mechanicals,” for pinouts and package drawings.
3.4
EMI (Electromagnetic Interference) Characteristics
Table 4. EMI Testing Specifications 1
1 EMI testing and I/O port waveforms per SAE J1752/3 issued 1995-03. Qualification testing was performed on the MPC5554
and applied to the MPC5500 family as generic EMI performance data.
Spec
Characteristic
Minimum
Typical
Maximum
Unit
1
Scan range
0.15
—
1000
MHz
2
Operating frequency
—
fMAX
MHz
3VDD operating voltages
—
1.5
—
V
4VDDSYN, VRC33, VDD33, VFLASH, VDDE operating voltages
—
3.3
—
V
5VPP, VDDEH, VDDA operating voltages
—
5.0
—
V
6
Maximum amplitude
—
14 2
32 3
2 Measured with the single-chip EMI program.
3 Measured with the expanded EMI program.
dBuV
7
Operating temperature
—
25
oC
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MPC5554EVBE 功能描述:開(kāi)發(fā)板和工具包 - 其他處理器 MPC5554 CUSTOMER Qorivva RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類(lèi)型:I2C, SPI, USB 工作電源電壓:
MPC5554EVBE 制造商:Freescale Semiconductor 功能描述:MPC5554 CUSTOMER DEMO BD
MPC5554EVBGHS 功能描述:開(kāi)發(fā)軟件 GREEN HILLS SW Qorivva RoHS:否 制造商:Atollic Inc. 產(chǎn)品:Compilers/Debuggers 用于:ARM7, ARM9, Cortex-A, Cortex-M, Cortex-R Processors
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