參數(shù)資料
型號: MM908E626
廠商: 飛思卡爾半導體(中國)有限公司
元件分類: 基準電壓源/電流源
英文描述: Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication
中文描述: 集成的步進電機驅動器,帶有嵌入式微控制器和LIN串行通信
文件頁數(shù): 35/38頁
文件大小: 507K
代理商: MM908E626
Analog Integrated Circuit Device Data
Freescale Semiconductor
35
908E626
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 1.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 1.0)
Introduction
This thermal addendum ia provided as a supplement to the MM908E626
technical data sheet. The addendum provides thermal performance information
that may be critical in the design and development of system applications. All
electrical, application and packaging information is provided in the data sheet.
Package and Thermal Considerations
This MM908E626 is a dual die package. There are two heat sources in the
package independently heating with P
1
and P
2
. This results in two junction
temperatures, T
J1
and T
J2
, and a thermal resistance matrix with R
θ
JA
mn
.
For
m
,
n
= 1, R
θ
JA11
is the thermal resistance from Junction 1 to the reference
temperature while only heat source 1 is heating with P
1
.
For
m
= 1,
n
= 2, R
θ
JA12
is the thermal resistance from Junction 1 to the
reference temperature while heat source 2 is heating with P
2
. This applies to
R
θ
J21
and R
θ
J22
, respectively.
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not meant to and will not predict the performance of a
package in an application-specific environment. Stated values were obtained by measurement and simulation according to the
standards listed below.
Standards
Figure 19. Thermal Land Pattern for Direct Thermal
Attachment Per JEDEC JESD51-5Thermal Test Board
54-TERMINAL
SOICW-EP
908E626
DWB SUFFIX
98ARL105910
54-TERMINAL SOICW-EP
Note
For package dimensions, refer to the
908E626 device datasheet.
T
J1
T
J2
=
R
θ
JA11
R
θ
JA21
R
θ
JA12
R
θ
JA22
.
P
1
P
2
Table 9. Thermal Performance Comparison
Thermal
Resistance
1 = Power Chip, 2 = Logic Chip
[
°
C/W]
m
= 1,
n
= 1
m
= 1,
n
= 2
m
= 2,
n
= 1
m
= 2,
n
= 2
R
θ
JA
mn
(1)(2)
23
20
24
R
θ
JB
mn
(2)(3)
9.0
6.0
10
R
θ
JA
mn
(1)(4)
52
47
52
R
θ
JC
mn
(5)
1.0
0
2.0
Notes:
1.
Per JEDEC JESD51-2 at natural convection, still air
condition.
2s2p thermal test board per JEDEC JESD51-7and
JESD51-5.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the power outputs.
Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
Thermal resistance between the die junction and the
exposed pad, “infinite” heat sink attached to exposed pad.
2.
3.
4.
5.
1.0
1.0
0.2
0.2
Soldermast
openings
Thermal vias
connected to top
buried plane
54 Terminal SOIC-EP
0.65 mm Pitch
17.9 mm x 7.5 mm Body
10.3 mm x 5.1 mm Exposed Pad
* All measurements
are in millimeters
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相關代理商/技術參數(shù)
參數(shù)描述
MM908E626AVDWB 功能描述:馬達/運動/點火控制器和驅動器 QUADSTEPPER RoHS:否 制造商:STMicroelectronics 產品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube
MM908E626AVDWB/R2 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Integrated Stepper Motor Driver with Embedded MCU and LIN Serial Communication
MM908E626AVEK 功能描述:馬達/運動/點火控制器和驅動器 QUADSTEPPER W/MCU RoHS:否 制造商:STMicroelectronics 產品:Stepper Motor Controllers / Drivers 類型:2 Phase Stepper Motor Driver 工作電源電壓:8 V to 45 V 電源電流:0.5 mA 工作溫度:- 25 C to + 125 C 安裝風格:SMD/SMT 封裝 / 箱體:HTSSOP-28 封裝:Tube
MM908E626AVPEK 功能描述:8位微控制器 -MCU MCU + LIN + MOTOR DRIVER RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風格:SMD/SMT
MM908E626AVPEKR2 功能描述:8位微控制器 -MCU RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風格:SMD/SMT