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參數(shù)資料
| 型號(hào)： | MCZ33298EG |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 16/28頁(yè) |
| 文件大小： | 0K |
| 描述： | IC SWITCH 8X LOSIDE W/SPI 24SOIC |
| 標(biāo)準(zhǔn)包裝： | 30 |
| 系列： | * |
| 應(yīng)用： | * |
| 接口： | * |
| 電源電壓： | * |
| 封裝/外殼： | 24-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-SOIC |
| 包裝： | 管件 |
| 安裝類型： | 表面貼裝 |
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Analog Integrated Circuit Device Data
Freescale Semiconductor
23
33298
FUNCTIONAL DESCRIPTION
FAULT LOGIC OPERATION
ARCHIVE
INFORMATION
ARCHIVE
INFORMATION
inches, having double sided circuit traces of 1.0 ounce
copper soldered to each device pin. The board temperature
was measured with thermal couple soldered to the board
surface one inch away from the center of the device. The
ambient temperature of the enclosure was measured with a
second thermal couple located over the center of one inch
distance from device.
THERMAL PERFORMANCE
Figure 22 illustrates the worst case thermal component
parameters values for the 33298 in the 20-pin plastic power
DIP and the SOP-24 wide body surface mount package. Pins
5, 6, 15, and 16 of the power DIP package are connected
directly to the lead frame flag. The parameter values
indicated take into account adjacent output combinations.
The characterization was conducted over power dissipation
levels of 0.7 to 17W. The junction-to-ambient temperature
thermal resistance was found to be 37°C/W with a single
output active (31°C/W with all outputs dissipating equal
power) and in conjunction with this, the thermal resistance
from junction to PC board (RJUNCTION-BOARD) was found to be
27°C/W (board temperature, measure one inch from device
center). Additionally, the thermal resistance from junction-to-
heatsink lead was found to approximate 10°C/W. Devoting
additional PC board metal around the heatsinking pins
improved RPKG from 30° to 28°C/W.
The SOP-24 package has pins 5, 6, 7, 8, 17, 18, 19, and
20 of the package connected directly to the lead frame flag.
Characterization was conducted in the same manner as with
the DIP package. The junction-to-ambient temperature
resistance was found to be 40°C/W with a single output active
(34°C/W with all outputs dissipating equal power0 and the
thermal resistance from junction-to-PC board
(RJUNCTION-BOARD) to be 30°C/W (board temperature,
measure one inch from device center). The junction-to-
heatsink lead resistance was found again to approximate
10°C/W. Devoting additional PC board metal around the
heatsinking pins for this package improved the Rpkg from 33°
to 31°C/W.
The total power dissipation available is dependent on the
number of outputs enabled at any one time. At 25°C the
RDS(ON) in 450mΩ with a coefficient of 6500 ppm/°C. For the
junction temperature to remain below 150°C, the maximum
available power dissipation must decrease as the ambient
output limit of current at ambient temperatures necessary
when one, four, or eight outputs are enable ON. 25 illustrates
how the RDS(ON) output value is affected by junction
temperature.
Figure 22. Thermal Model (Electrical Equivalent)
Junction Temperature Node
VD - TD (C°)
(Volts represent Die Surface Temperature)
IPWR (Steady State or Transient)
(1.0A = 1.0W of Device Power Dissipation)
Flag Temperature Node
Ambient Temperature Node
VA = TA (C°)
(1.0V = 1°C Ambient Temperature)
CPKG = CFLAG + CPC Board
RPKG = RLEADS +RPC Board
Output 0
Output 1
Output 2
Output 6
Output 7
Rd0
Rd1
Rd2
Rd6
Rd7
Cd0
Cd1
Cd2
Cd6
Cd7
Package
RDX
(
Ω)*
CDX
(F)*
RPKG
(
Ω)*
CPKG
(F)*
20 pin Dip
SOP-24L
7.0
0.002
30
33
0.2
0.15
*
Ω = °C/W, F = W s/°C, IPWR = W, and VA = °C
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