參數(shù)資料
型號(hào)： MCZ33291LEG
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： Eight-Output Switch with Serial Peripheral Interface I/O
中文描述： 8輸出開(kāi)關(guān)串行外設(shè)接口的I / O
文件頁(yè)數(shù)： 21/25頁(yè)
文件大?。?/td> 389K
代理商： MCZ33291LEG
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
33291L
FUNCTIONAL DESCRIPTION
conducted with the device mounted on a typical PC board
placed horizontally in a 33 cubic inch still air enclosure. The
PC board was made of FR4 material measuring 2.5 by
2.5 inches, having double-sided circuit traces of 1.0 ounce
copper soldered to each device pin. The board temperature
was measured with thermal couple soldered to the board
surface one inch away from the center of the device. The
ambient temperature of the enclosure was measured with a
second thermal couple located over the center of one inch
distance from device.
THERMAL PERFORMANCE
Figure 21
illustrates the worst case thermal component
parameters values for the 33291L in the 24-lead SOIC wide
body surface mount package. Pins 5, 6, 7, 8, 17, 18, 19, and
20 of the package were connected directly to the lead frame
flag. The parameter values indicated take into account
adjacent output combinations. The characterization was
conducted over power dissipation levels of 0.7 W to 17 W.
The junction-to-ambient temperature resistance was found to
be 40°C/W with a single output active (34°C/W with all
outputs dissipating equal power 0 and the thermal resistance
from junction-to-PC board (R
junction-board
) to be 30°C/W
(board temperature, measure one inch from device center).
The junction-to-heatsink lead resistance was found again to
approximate 10°C/W. Devoting additional PC board metal
around the heatsinking pins for this package improved the
R
pkg
from 33° to 31°C/W.
The total power dissipation available is dependent on the
number of outputs enabled at any one time. At 25°C the
R
DS(ON)
in 450 m
with a coefficient of 6500 ppm/°C. For the
junction temperature to remain below 150°C, the maximum
available power dissipation must decrease as the ambient
temperature increases.
Figure 24
depicts the per output limit
of current at ambient temperatures necessary when one,
four, or eight outputs are enable ON.
Figure 23
illustrates
how the R
DS(ON)
output value is affected by junction
temperature.
Figure 21. Thermal Model (Electrical Equivalent)
Junction Temperature Node
V
D
- T
D
(C°)
(Volts represent Die Surface Temperature)
I
PWR
(Steady State or Transient)
(1.0 A = 1.0 W of Device Power Dissipation)
Flag Temperature Node
Ambient Temperature Node
V
A
= T
A
(C°)
(1.0 V = 1°C Ambient Temperature)
C
pkg
= C
flag
+ C
PC Board
R
pkg
= R
leads
+ R
PC Board
Output 0
Output 1
Output 2
Output 6
Output 7
R
d0
R
d1
R
d2
R
d6
R
d7
C
d0
C
d1
C
d2
C
d6
C
d7
Package
Rdx
(
)*
C
dx
(F)*
R
pkg
(
)*
C
pkg
(F)*
24-Lead
SOIC
7.0
0.002
33
0.15
*
= °C/W, F = W s/°C, I
PWR
= W, and V
A
= °C
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